发明授权
- 专利标题: Transfer molding apparatus and method for manufacturing semiconductor devices
- 专利标题(中): 传递成型装置及半导体装置的制造方法
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申请号: US10890222申请日: 2004-07-14
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公开(公告)号: US07253021B2公开(公告)日: 2007-08-07
- 发明人: Hiroyuki Nishi , Akira Sugai
- 申请人: Hiroyuki Nishi , Akira Sugai
- 申请人地址: JP Tokyo
- 专利权人: Oki Electric Industry Co., Ltd.
- 当前专利权人: Oki Electric Industry Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Volentine & Whitt, P.L.L.C.
- 优先权: JP10-215602 19980730
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.