发明授权
- 专利标题： Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
- 专利标题（中）： 制造具有形成为天线结构的导电层的叠层形式的包装材料的方法
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申请号： US11124593申请日： 2005-05-06
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公开(公告)号： US07254883B2公开(公告)日： 2007-08-14
- 发明人: Günter Schmid , Hagen Klauk , Marcus Halik
- 申请人： Günter Schmid , Hagen Klauk , Marcus Halik
- 申请人地址： DE Munich
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Munich
- 代理商 Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- 优先权： DE10229168 20020628
- 主分类号： H02P11/00
- IPC分类号： H02P11/00
摘要：
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
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