发明授权
- 专利标题： Process for forming a patterned thin film structure on a substrate
- 专利标题（中）： 在衬底上形成图案化薄膜结构的工艺
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申请号： US10666912申请日： 2003-09-19
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公开(公告)号： US07261920B2公开(公告)日： 2007-08-28
- 发明人: Jeanne E. Haubrich , Yi-Shung Chaug , Zarng-Arh George Wu , Rong-Chang Liang
- 申请人： Jeanne E. Haubrich , Yi-Shung Chaug , Zarng-Arh George Wu , Rong-Chang Liang
- 申请人地址： US CA Fremont
- 专利权人： SiPix Imaging, Inc.
- 当前专利权人： SiPix Imaging, Inc.
- 当前专利权人地址： US CA Fremont
- 代理机构： Howrey LLP
- 主分类号： B05D1/32
- IPC分类号： B05D1/32 ; B05D3/10 ; B05D5/12 ; H01L21/31 ; H01L21/36 ; B32B31/10 ; B32B43/00
摘要：
A process for forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structures.