Invention Grant
US07265449B2 Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package
有权
带状电路基板，包括其的半导体芯片封装以及包括半导体芯片封装的液晶显示装置
- Patent Title: Tape circuit substrate, semiconductor chip package including the same, and liquid crystal display device including the semiconductor chip package
- Patent Title (中): 带状电路基板，包括其的半导体芯片封装以及包括半导体芯片封装的液晶显示装置
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Application No.: US11186096Application Date: 2005-07-21
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Publication No.: US07265449B2Publication Date: 2007-09-04
- Inventor: Hee-bum Park , Ock-jin Kim , Jin-ho Park , Kwang-soo Lee
- Applicant: Hee-bum Park , Ock-jin Kim , Jin-ho Park , Kwang-soo Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2004-0066274 20040823
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/14
Abstract:
A liquid crystal display device includes a liquid crystal panel including a pad electrode, a tape circuit substrate and an anisotropic conductive film. The pad electrode receives one of a driving signal and a power supply voltage signal. The tape circuit substrate includes a base film made of an insulating material, and a signal line formed on the base film and having a slit at a portion of the signal line which overlaps the pad electrode of the liquid crystal panel. The anisotropic conductive film connects the outer lead with the pad electrode.
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