- 专利标题: Array capacitors with voids to enable a full-grid socket
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申请号: US10747965申请日: 2003-12-29
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公开(公告)号: US07265995B2公开(公告)日: 2007-09-04
- 发明人: Kaladhar Radhakrishnan , Dustin P. Wood , Nicholas L. Holmberg
- 申请人: Kaladhar Radhakrishnan , Dustin P. Wood , Nicholas L. Holmberg
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H05K7/00
- IPC分类号: H05K7/00
摘要:
An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers interleaved with a number of second conductive layers and a number of dielectric layers separating adjacent conductive layers. The array capacitor further includes a number of first conductive vias to electrically connect the first conductive layers and a number of second conductive vias to electrically connect the second conductive layers. The array capacitor is provided with openings which are configured to enable pins from an IC package to pass through.
公开/授权文献
- US20050141206A1 Array capacitors with voids to enable a full-grid socket 公开/授权日:2005-06-30