Invention Grant
- Patent Title: Method and system for fabricating three-dimensional microstructure
- Patent Title (中): 制造三维微结构的方法和系统
-
Application No.: US10712147Application Date: 2003-11-13
-
Publication No.: US07267731B2Publication Date: 2007-09-11
- Inventor: Kouji Iwasaki
- Applicant: Kouji Iwasaki
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2002-330845 20021114; JP2003-060883 20030307
- Main IPC: C21D1/54
- IPC: C21D1/54

Abstract:
A method of fabricating a three-dimensional microstructure provides data corresponding to information relating to the structure of a three-dimensional microstructure design. A sample is processed in accordance with the provided data by irradiating the sample with a charged-particle beam while controlling processing conditions of the charged-particle beam. Dimensions of the processed sample are compared with the provided data to identify differences between the structure of the processed sample and the structure of the three-dimensional microstructure design. The sample is then irradiated again with a charged-particle beam to correct the identified structural differences while adjusting the processing conditions of the charged-particle beam to thereby fabricate a three-dimensional microstructure having a structure substantially the same as the structure of the three-dimensional microstructure design.
Public/Granted literature
- US20040129351A1 Method and system for fabricating three-diemensional microstructure Public/Granted day:2004-07-08
Information query