Invention Grant
US07267731B2 Method and system for fabricating three-dimensional microstructure 有权
制造三维微结构的方法和系统

  • Patent Title: Method and system for fabricating three-dimensional microstructure
  • Patent Title (中): 制造三维微结构的方法和系统
  • Application No.: US10712147
    Application Date: 2003-11-13
  • Publication No.: US07267731B2
    Publication Date: 2007-09-11
  • Inventor: Kouji Iwasaki
  • Applicant: Kouji Iwasaki
  • Applicant Address: JP
  • Assignee: SII NanoTechnology Inc.
  • Current Assignee: SII NanoTechnology Inc.
  • Current Assignee Address: JP
  • Agency: Adams & Wilks
  • Priority: JP2002-330845 20021114; JP2003-060883 20030307
  • Main IPC: C21D1/54
  • IPC: C21D1/54
Method and system for fabricating three-dimensional microstructure
Abstract:
A method of fabricating a three-dimensional microstructure provides data corresponding to information relating to the structure of a three-dimensional microstructure design. A sample is processed in accordance with the provided data by irradiating the sample with a charged-particle beam while controlling processing conditions of the charged-particle beam. Dimensions of the processed sample are compared with the provided data to identify differences between the structure of the processed sample and the structure of the three-dimensional microstructure design. The sample is then irradiated again with a charged-particle beam to correct the identified structural differences while adjusting the processing conditions of the charged-particle beam to thereby fabricate a three-dimensional microstructure having a structure substantially the same as the structure of the three-dimensional microstructure design.
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