发明授权
- 专利标题: Circuit board and liquid discharging apparatus
- 专利标题(中): 电路板和液体排放装置
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申请号: US10968901申请日: 2004-10-21
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公开(公告)号: US07270398B2公开(公告)日: 2007-09-18
- 发明人: Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
- 申请人: Keiichi Sasaki , Masato Kamiichi , Ershad Ali Chowdhury , Yukihiro Hayakawa
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitzpatrick, Cella, Harper & Scinto
- 优先权: JP2003-096675 20030331
- 主分类号: B41J2/05
- IPC分类号: B41J2/05
摘要:
A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
公开/授权文献
- US20050078152A1 Circuit board and liquid discharging apparatus 公开/授权日:2005-04-14
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