-
公开(公告)号：US07270398B2
公开(公告)日：2007-09-18
申请号：US10968901
申请日：2004-10-21
IPC分类号： B41J2/05
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
-
公开(公告)号：US07244370B2
公开(公告)日：2007-07-17
申请号：US10910271
申请日：2004-08-04
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译： 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法， 在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤 通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。
-
3.发明授权Manufacturing method of circuit board, circuit board, and liquid discharging apparatus 有权电路板，电路板和液体排放装置的制造方法公开(公告)号：US06838351B2
公开(公告)日：2005-01-04
申请号：US10805191
申请日：2004-03-22
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
-
公开(公告)号：US20050031996A1
公开(公告)日：2005-02-10
申请号：US10910271
申请日：2004-08-04
CPC分类号： H05K1/167 , B41J2/14072 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1643 , B41J2/1646 , H05K1/09 , H05K3/06 , H05K3/067 , H05K2201/0317 , H05K2203/0361
摘要： In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.
摘要翻译： 为了通过利用这种电路基板的布线边缘部分中的保护层和防空穴膜提供令人满意的阶梯覆盖的电路基板，本发明提供一种制造电路基板的方法， 在基板的绝缘表面上，多个元件各自包括电阻层和在所述电阻层上以预定间隔形成的一对电极，包括在电阻层上形成铝电极布线层的步骤，步骤 通过干蚀刻将电极配线层隔离成各元件，以及通过含有与配线金属形成络合物的磷酸，硝酸和螯合剂的蚀刻液将电极配线形成为锥形截面的工序。
-
公开(公告)号：US20050078152A1
公开(公告)日：2005-04-14
申请号：US10968901
申请日：2004-10-21
IPC分类号： B41J2/05 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/02
CPC分类号： H01C17/065 , H01C17/281 , H05K1/167 , H05K3/02 , Y10T29/49126
摘要： A circuit board for a liquid discharging apparatus in which coating performance of a protective layer and a cavitation resistive film on a heat generating element is excellent and durability is excellent and a manufacturing method of such a circuit board are provided. A surface portion of a wiring material layer is processed so that an etching speed of the surface portion is made higher than that of the material forming the wiring material layer. It is desirable to execute a process for forming at least one selected from a fluoride, a chloride, and a nitride of the material forming the wiring material layer into the surface portion of the wiring material layer.
摘要翻译： 一种用于液体排放装置的电路板，其中发热元件上的保护层和空穴电阻膜的涂层性能优异且耐久性优异，并且提供了这种电路板的制造方法。 处理布线材料层的表面部分，使得表面部分的蚀刻速度高于形成布线材料层的材料的蚀刻速度。 期望的是，将形成布线材料层的材料的氟化物，氯化物和氮化物中的至少一种形成到布线材料层的表面部分中。
-
公开(公告)号：US20060068570A1
公开(公告)日：2006-03-30
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： H01L21/20
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
-
7.发明授权Structure with through hole, production method thereof, and liquid discharge head 有权具有通孔的结构，其制造方法和排液头公开(公告)号：US07270759B2
公开(公告)日：2007-09-18
申请号：US11272869
申请日：2005-11-15
申请人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Momma , Masato Kamiichi
IPC分类号： B41J2/16
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
摘要翻译： 通过生产步骤减少和可靠性提高，构造了在硅等的基板中具有通孔的结构。 至少在通孔的边缘附近的基板的一部分上形成与氧化硅膜的上表面接触的氮化硅膜，从而提高氮化硅膜的台阶覆盖。 氧化硅膜和氮化硅膜在从基板的背面进行蚀刻形成通孔期间用作膜。
-
8.发明授权Structure with through hole, production method thereof, and liquid discharge head 有权具有通孔的结构，其制造方法和排液头公开(公告)号：US07018020B2
公开(公告)日：2006-03-28
申请号：US10270650
申请日：2002-10-16
申请人： Yukihiro Hayakawa , Genzo Monma , Masato Kamiichi
发明人： Yukihiro Hayakawa , Genzo Monma , Masato Kamiichi
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1642 , H01L23/481 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： A structure is constructed having a through hole in a substrate of silicon or the like by a decreased number of steps in production and with improved reliability. A silicon nitride film is formed in contact with an upper surface of a silicon oxide film at least on a portion of the substrate near the edge of a through hole, thereby improving step coverage of the silicon nitride film. The silicon oxide film and silicon nitride film function as a membrane during formation of the through hole by etching from the back side of the substrate.
摘要翻译： 通过生产步骤减少和可靠性提高，构造了在硅等的基板中具有通孔的结构。 至少在通孔的边缘附近的基板的一部分上形成与氧化硅膜的上表面接触的氮化硅膜，从而提高氮化硅膜的台阶覆盖。 氧化硅膜和氮化硅膜在从基板的背面进行蚀刻形成通孔期间用作膜。
-
9.发明授权Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board 有权电路板，液体排出装置以及制造电路板的方法公开(公告)号：US07309657B2
公开(公告)日：2007-12-18
申请号：US10929492
申请日：2004-08-31
申请人： Masato Kamiichi , Keiichi Sasaki
发明人： Masato Kamiichi , Keiichi Sasaki
IPC分类号： H01L21/302
CPC分类号： B41J2/1642 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1646 , H05K1/167 , H05K3/06 , H05K2201/0317 , H05K2203/1453 , Y10T428/24917
摘要： Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.
摘要翻译： 提供一种制造电路板的方法，该电路板包括形成在基板的表面部分上方的电极布线，以及多个电热转换元件，其具有用于产生形成在电极布线上方的热能的加热电阻膜。 该方法包括：形成用于形成电极布线的电极布线层，形成加热电阻膜; 并且共同地蚀刻电极布线层和加热电阻膜，从而形成电极布线。 利用根据本发明的方法，可以制造具有更高密度，更高耐久性和更低功耗记录头的电路板，以提供高分辨率图像。
-
10.发明申请Circuit board, liquid discharge apparatus, and method of manufacturing the circuit board 有权电路板，液体排出装置以及制造电路板的方法公开(公告)号：US20050053774A1
公开(公告)日：2005-03-10
申请号：US10929492
申请日：2004-08-31
申请人： Masato Kamiichi , Keiichi Sasaki
发明人： Masato Kamiichi , Keiichi Sasaki
CPC分类号： B41J2/1642 , B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1646 , H05K1/167 , H05K3/06 , H05K2201/0317 , H05K2203/1453 , Y10T428/24917
摘要： Provided is a method for manufacturing a circuit board including an electrode wiring formed above a surface portion of a substrate, and a plurality of electrothermal converting elements which have a heating resistor film for generating thermal energy formed above the electrode wiring. The method includes: forming an electrode wiring layer for forming the electrode wiring, forming the heating resistor film; and collectively etching the electrode wiring layer and the heating resistor film to thereby form the electrode wiring. With the method according to the present invention, the circuit board can be manufactured with a higher density, higher endurance, and lower power consumption recording head to provide high resolution images.
摘要翻译： 提供一种制造电路板的方法，该电路板包括形成在基板的表面部分上方的电极布线，以及多个电热转换元件，其具有用于产生形成在电极布线上方的热能的加热电阻膜。 该方法包括：形成用于形成电极布线的电极布线层，形成加热电阻膜; 并且共同地蚀刻电极布线层和加热电阻膜，从而形成电极布线。 利用根据本发明的方法，可以制造具有更高密度，更高耐久性和更低功耗记录头的电路板，以提供高分辨率图像。
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.02 秒)
