发明授权
US07270845B2 Dielectric composition for forming dielectric layer for use in circuitized substrates
有权
用于形成用于电路化基板的电介质层的介电组合物
- 专利标题： Dielectric composition for forming dielectric layer for use in circuitized substrates
- 专利标题（中）： 用于形成用于电路化基板的电介质层的介电组合物
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申请号： US10812889申请日： 2004-03-31
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公开(公告)号： US07270845B2公开(公告)日： 2007-09-18
- 发明人: Robert Japp , Kostas Papathomas
- 申请人： Robert Japp , Kostas Papathomas
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell, LLP
- 代理商 Lawrence R. Fraley
- 主分类号： H01K3/10
- IPC分类号： H01K3/10
摘要：
A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.
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