Invention Grant
- Patent Title: Method of making an electronic package
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Application No.: US11182167Application Date: 2005-07-15
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Publication No.: US07278207B2Publication Date: 2007-10-09
- Inventor: Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
- Applicant: Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent John A. Jordan; William H. Steinberg
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H01R12/04 ; H01L21/00

Abstract:
An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.
Public/Granted literature
- US20050250249A1 Method of making an electronic package Public/Granted day:2005-11-10
Information query