Invention Grant
US07288474B2 Suspension for filling via holes in silicon and method for making the same
有权
用于通过硅中的孔填充的悬浮液及其制造方法
- Patent Title: Suspension for filling via holes in silicon and method for making the same
- Patent Title (中): 用于通过硅中的孔填充的悬浮液及其制造方法
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Application No.: US11544220Application Date: 2006-10-10
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Publication No.: US07288474B2Publication Date: 2007-10-30
- Inventor: Jon A. Casey , Brian R. Sundlof
- Applicant: Jon A. Casey , Brian R. Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: DeLio & Peterson, LLC
- Agent Robert Curcio; Ira D. Blecker
- Main IPC: H01L21/4763
- IPC: H01L21/4763

Abstract:
A metallization process and material system for metallizing either blind or through vias in silicon, involving forming a low coefficient of thermal expansion composite or suspension, relative to pure metals, such as copper, silver, or gold, and filling the via holes in the silicon with the paste or suspension. The suspensions sinter with minimal bulk shrinkage, forming highly conductive structures without the formation of macroscopic voids. The selected suspension maintains a coefficient of thermal expansion closer to that of silicon.
Public/Granted literature
- US20070032078A1 Suspension for filling via holes in silicon and method for making the same Public/Granted day:2007-02-08
Information query
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