发明授权
US07294565B2 Method of fabricating a wire bond pad with Ni/Au metallization
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用Ni / Au金属化制造引线接合焊盘的方法
- 专利标题： Method of fabricating a wire bond pad with Ni/Au metallization
- 专利标题（中）： 用Ni / Au金属化制造引线接合焊盘的方法
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申请号： US10676172申请日： 2003-10-01
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公开(公告)号： US07294565B2公开(公告)日： 2007-11-13
- 发明人: Lloyd G. Burrell , Charles R. Davis , Ronald D. Goldblatt , William F. Landers , Sanjay C. Mehta
- 申请人： Lloyd G. Burrell , Charles R. Davis , Ronald D. Goldblatt , William F. Landers , Sanjay C. Mehta
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Kerry B. Goodwin, Esq.
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; H01L23/48
摘要：
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
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