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公开(公告)号：US07294565B2
公开(公告)日：2007-11-13
申请号：US10676172
申请日：2003-10-01
申请人： Lloyd G. Burrell , Charles R. Davis , Ronald D. Goldblatt , William F. Landers , Sanjay C. Mehta
发明人： Lloyd G. Burrell , Charles R. Davis , Ronald D. Goldblatt , William F. Landers , Sanjay C. Mehta
CPC分类号： H01L24/05 , H01L23/3192 , H01L23/53223 , H01L24/03 , H01L2224/04042 , H01L2224/0501 , H01L2224/05022 , H01L2224/05082 , H01L2224/05124 , H01L2224/05155 , H01L2224/05644 , H01L2224/45124 , H01L2224/48744 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2224/48
摘要： A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
摘要翻译： 提供了一种通过能够防止在Ni / Au焊盘冶金的无电沉积期间可能的化学侵蚀的材料来密封引线接合焊盘的暴露表面的方法。 具体地说，本发明提供了一种TiN / Ti或TiN / Al帽作为覆盖引线接合焊盘露出表面的保护涂层的方法。 TiN / Ti或TiN / Al帽不受用于形成Ni / Au金属化的碱性化学物质的影响，但它提供了将接合焊盘连接到Ni / Au焊盘金属化的足够的电通路。
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2.发明授权Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor 失效多功能结构，用于增强低k电介质半导体的芯片制造和可靠性，以及裂纹完整性屏幕和监视器公开(公告)号：US07098676B2
公开(公告)日：2006-08-29
申请号：US10338931
申请日：2003-01-08
申请人： William F. Landers , Thomas M. Shaw , Diana Llera-Hurlburt , Scott W. Crowder , Vincent J. McGahay , Sandra G. Malhotra , Charles R. Davis , Ronald D. Goldblatt , Brett H. Engel
发明人： William F. Landers , Thomas M. Shaw , Diana Llera-Hurlburt , Scott W. Crowder , Vincent J. McGahay , Sandra G. Malhotra , Charles R. Davis , Ronald D. Goldblatt , Brett H. Engel
CPC分类号： H01L23/585 , H01L22/34 , H01L2924/0002 , H01L2924/00
摘要： An on-chip redundant crack termination barrier structure, or crackstop, provides a barrier for preventing defects, cracks, delaminations, and moisture/oxidation contaminants from reaching active circuit regions. Conductive materials in the barrier structure design permits wiring the barriers out to contact pads and device pins for coupling a monitor device to the chip for monitoring barrier integrity.
摘要翻译： 片上冗余裂纹终止阻挡结构或裂缝挡板为防止缺陷，裂纹，脱层和水分/氧化污染物到达有源电路区域提供了屏障。 阻挡结构设计中的导电材料允许将屏障布线到接触垫和器件引脚上，用于将监测器件耦合到芯片以监测屏障完整性。
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公开(公告)号：US5357005A
公开(公告)日：1994-10-18
申请号：US805213
申请日：1991-12-11
IPC分类号： C08G18/40 , B05D3/14 , B29C59/14 , C08F8/00 , C08F255/00 , C08F283/00 , C08G59/18 , C08G64/40 , C08G65/00 , C08G83/00 , C08G85/00 , C08J7/18 , H01L23/02 , C08F20/00 , B05D3/04 , C08F283/04 , C08L77/06
CPC分类号： C08J7/123 , B05D3/144 , B29C59/14 , Y10T428/31721
摘要： Method for treating surface of dielectric polymer with water vapor plasma to form reactive sites and grafting a reactive polymer thereto to tailor the properties of the dielectric polymer surface.
摘要翻译： 用水蒸汽等离子体处理介电聚合物表面以形成反应位点并将反应性聚合物接枝到其上的方法来调节介电聚合物表面的性质。
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公开(公告)号：US5340451A
公开(公告)日：1994-08-23
申请号：US61815
申请日：1993-05-13
申请人： Leena P. Buchwalter , Stephen L. Buchwalter , Charles R. Davis , Ronald D. Goldblatt , John E. Heidenreich, III , Sharon L. Nunes , Jae M. Park , Richard R. Thomas , Domenico Tortorella , Luis M. Ferreiro, deceased
发明人： Leena P. Buchwalter , Stephen L. Buchwalter , Charles R. Davis , Ronald D. Goldblatt , John E. Heidenreich, III , Sharon L. Nunes , Jae M. Park , Richard R. Thomas , Domenico Tortorella , Luis M. Ferreiro, deceased
CPC分类号： C23C18/22 , H05K1/034 , H05K1/0346 , H05K3/181 , H05K3/381
摘要： A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.
摘要翻译： 公开了通过使聚合物与等离子体接触，然后与金属盐水溶液接触来制备金属 - 有机聚合物组合的方法。 在一个实施方案中，使用水或一氧化二氮等离子体来处理聚酰亚胺或含氟聚合物。 聚合物与金属阳离子结合，金属是用于常规化学镀的催化剂，之后与用于形成电路的无电金属电镀浴接触，特别是用于在微电路中电镀高纵横比通孔。 与常规的无电镀方法不同，在施加无电镀金属溶液之前，阳离子催化金属不会还原为零价金属催化剂。 该方法还提高聚合物，特别是氟化聚合物的润湿性，并且特别可用于改善高纵横比通孔的润湿性。
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5.发明授权Lamination method for coating the sidewall or filling a cavity in a substrate 失效用于涂覆侧壁或填充基材中的空腔的层压方法
公开(公告)号：US5208068A
公开(公告)日：1993-05-04
申请号：US626327
申请日：1990-12-13
CPC分类号： B23K26/382 , B23K26/362 , B23K26/386 , B23K26/40 , B23K26/402 , H05K1/056 , H05K3/445 , B23K2201/35 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/166 , B23K2203/50 , H05K2201/0129 , H05K2201/09581 , H05K2203/0278 , H05K2203/068 , H05K2203/1438
摘要： Method for pressing a material into a through-hole or blind-hole in a substrate. The material is disposed on the surface of the substrate. An environment is provided permitting the material to flow for example by heating the material to the glass transition temperature or above. Thereafter pressure is applied causing the material to flow, first coating the sidewall of the hole and on the continued application of pressure the material flows to completely fill the hole. The resulting substrate can have a substantially planar surface having holes with the periphery coated with or completely filled with the material. The material is preferably a thermoplastic polymeric material such as a polyimide and a perfluorinated polymer.
摘要翻译： 将材料压入基板中的通孔或盲孔的方法。 该材料设置在基板的表面上。 提供允许材料流动的环境，例如通过将材料加热至玻璃化转变温度或更高温度。 此后施加压力导致材料流动，首先涂覆孔的侧壁，并且在继续施加压力时材料流动以完全填充孔。 所得到的基底可以具有基本上平坦的表面，其具有用周围涂覆或完全填充材料的孔。 该材料优选为热塑性聚合材料，例如聚酰亚胺和全氟化聚合物。
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6.发明授权Unique feature design enabling structural integrity for advanced low K semiconductor chips 有权独特的功能设计使得先进的低K半导体芯片具有结构完整性公开(公告)号：US06650010B2
公开(公告)日：2003-11-18
申请号：US10078174
申请日：2002-02-15
IPC分类号： H01L2312
CPC分类号： H01L22/32 , H01L23/5226 , H01L23/5329 , H01L24/05 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05554 , H01L2224/06131 , H01L2224/06155 , H01L2924/12044
摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.
摘要翻译： 在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。 网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。 导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。 加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。
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7.发明授权Unique feature design enabling structural integrity for advanced low k semiconductor chips 有权独特的功能设计使先进的低k半导体芯片具有结构完整性公开(公告)号：US06815346B2
公开(公告)日：2004-11-09
申请号：US10437208
申请日：2003-05-13
IPC分类号： H01L2144
CPC分类号： H01L22/32 , H01L23/5226 , H01L23/5329 , H01L24/05 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05554 , H01L2224/06131 , H01L2224/06155 , H01L2924/12044
摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.
摘要翻译： 在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。 网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。 导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。 加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。
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公开(公告)号：US5833666A
公开(公告)日：1998-11-10
申请号：US532236
申请日：1995-09-22
申请人： Charles R. Davis , David Schucart , Lev Melinyshyn
发明人： Charles R. Davis , David Schucart , Lev Melinyshyn
IPC分类号： A61M25/02
CPC分类号： A61M25/02 , A61M2025/024 , A61M2025/0273 , A61M2025/028 , Y10S128/26
摘要： An assembly for externally securing a catheter at or adjacent to an exit site on a body tissue which includes a resilient member and a detachably removable and adjustable clamp which allow for a gentle bend in the catheter so that kinking is prevented.
摘要翻译： 一种用于将导管外部固定在身体组织上的出口部位处或附近的组件，其包括弹性构件和可拆卸地可移动和可调节的夹子，其允许导管中的平缓弯曲，从而防止扭结。
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公开(公告)号：US5280414A
公开(公告)日：1994-01-18
申请号：US536145
申请日：1990-06-11
IPC分类号： H01R43/02 , B23K35/00 , B23K35/30 , H01R4/02 , H05K3/28 , H05K3/32 , H05K3/40 , H05K3/46 , H05K3/36 , B32B31/00 , H05K1/11
CPC分类号： B23K35/3013 , B23K35/001 , H01R4/02 , H05K3/4614 , H01L2924/0132 , H05K2201/0305 , H05K3/28 , H05K3/328 , H05K3/4038 , Y10S428/901 , Y10T156/1056 , Y10T29/49126
摘要： A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, multilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.
摘要翻译： 公开了一种同时层压电路化电介质层以形成多层高性能电路板并制造层间电连接的方法。 该方法选择将在一个低温下形成共晶体的两种元素，并且将固化形成合金，该合金将仅在任何后续层压所需的第二温度下再熔化。 使用瞬态液体粘合技术和足够的Au和Sn制成接头，以在低温下产生Au-Sn20wt％共晶。 一旦固化，形成的合金在随后的叠片中保持固体。 结果，制造复合多层高性能电路板，通过固体合金在选定的焊盘处电连接。
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公开(公告)号：US5878130A
公开(公告)日：1999-03-02
申请号：US67809
申请日：1998-04-28
申请人： G. Wayne Andrews , Steven H. Webber , James P. Kelly , Lawrence E. Johnson , Jerry A. Stern , Vincent J. Milano, Jr. , Charles R. Davis
发明人： G. Wayne Andrews , Steven H. Webber , James P. Kelly , Lawrence E. Johnson , Jerry A. Stern , Vincent J. Milano, Jr. , Charles R. Davis
IPC分类号： H04M3/22 , H04M3/36 , H04M3/493 , H04M3/51 , H04M3/523 , H04M7/12 , H04Q3/66 , H04Q3/72 , H04M7/06
CPC分类号： H04Q3/66 , H04M3/493 , H04M3/5191 , H04M3/5237 , H04M2242/22 , H04M3/22 , H04M3/36 , H04M3/42042 , H04M3/42059 , H04M3/42102 , H04M7/12 , H04Q2213/13034 , H04Q2213/1307 , H04Q2213/13072 , H04Q2213/13091 , H04Q2213/13103 , H04Q2213/13104 , H04Q2213/13141 , H04Q2213/13148 , H04Q2213/13167 , H04Q2213/13206 , H04Q2213/13209 , H04Q2213/1322 , H04Q2213/13288 , H04Q2213/13296 , H04Q2213/13349 , H04Q2213/13377 , H04Q2213/13389 , H04Q3/72
摘要： A communications system and method for automatically making telephone routing decisions with "global authority" based upon information gathered in real time from the entire communications system and global optimization criteria. The present invention permits unified central control and management for the entire system.
摘要翻译： 一种用于根据从整个通信系统实时收集的信息和全局优化标准自动地进行具有“全局授权”的电话路由决定的通信系统和方法。 本发明允许对整个系统进行统一的中央控制和管理。
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