发明授权
- 专利标题： Micromechanical cap structure and a corresponding production method
- 专利标题（中）： 微机械盖结构和相应的生产方法
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申请号： US10483011申请日： 2002-07-04
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公开(公告)号： US07294894B2公开(公告)日： 2007-11-13
- 发明人: Frank Fischer , Peter Hein , Eckhard Graf
- 申请人： Frank Fischer , Peter Hein , Eckhard Graf
- 申请人地址： DE Stuttgart
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： DE Stuttgart
- 代理机构： Kenyon & Kenyon LLP
- 优先权： DE10132683 20010705
- 国际申请： PCT/DE02/02430 WO 20020704
- 国际公布： WO03/004403 WO 20030116
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.