Invention Grant
US07297600B2 Methods of forming fin field effect transistors using oxidation barrier layers
有权
使用氧化阻挡层形成鳍状场效应晶体管的方法
- Patent Title: Methods of forming fin field effect transistors using oxidation barrier layers
- Patent Title (中): 使用氧化阻挡层形成鳍状场效应晶体管的方法
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Application No.: US11020899Application Date: 2004-12-23
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Publication No.: US07297600B2Publication Date: 2007-11-20
- Inventor: Chang-Woo Oh , Dong-Gun Park , Dong-Won Kim , Yong-Kyu Lee
- Applicant: Chang-Woo Oh , Dong-Gun Park , Dong-Won Kim , Yong-Kyu Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2004-0040986 20040604
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of forming a fin field effect transistor on a semiconductor substrate includes forming a fin-shaped active region vertically protruding from the substrate. An oxide layer is formed on a top surface and opposing sidewalls of the fin-shaped active region. An oxidation barrier layer is formed on the opposing sidewalls of the fin-shaped active region and is planarized to a height no greater than about a height of the oxide layer to form a fin structure. The fin structure is oxidized to form a capping oxide layer on the top surface of the fin-shaped active region and to form at least one curved sidewall portion proximate the top surface of the fin-shaped active region. The oxidation barrier layer has a height sufficient to reduce oxidation on the sidewalls of the fin-shaped active region about halfway between the top surface and a base of the fin-shaped active region. Related devices are also discussed.
Public/Granted literature
- US20050272192A1 Methods of forming fin field effect transistors using oxidation barrier layers and related devices Public/Granted day:2005-12-08
Information query
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