A heat sink assembly includes a circuit board, a first integrated circuit package and a second integrated circuit package mounted to the circuit board in a stacked relation to one another. A first heat sink is engaged to and is in thermal communication with the first integrated circuit package, and a second heat sink is engaged to and is in thermal communication with the second integrated circuit package, wherein each of the first and second heat sinks are positioned over the first and second integrated circuit packages on a single side of the circuit board. Optionally, the first heat sink may include an opening extending therethrough and exposing the second integrated circuit package. The second heat sink may extend through the opening and engage the second integrated circuit package.