摘要:
An electrical connector assembly includes an electrical connector and a tool. The electrical connector includes a contact having a compliant jog section disposed between first and second ends of the contact. The tool is required to press-fit the connector to an electrical device without deforming the compliant jog section of the contact.
摘要:
A connector assembly including a modified contact is disclosed for connecting a first electrical device to a second electrical device. In a first embodiment, the connector assembly includes a tool necessary to press-fit the connector to the second electrical device. In a second embodiment, the connector assembly includes two connectors that mate in such a manner so as to render the modified contact unusable if the two connectors are unmated.
摘要:
A connector assembly including a modified contact is disclosed for connecting a first electrical device to a second electrical device. In a first embodiment, the connector assembly includes a tool necessary to press-fit the connector to the second electrical device. In a second embodiment, the connector assembly includes two connectors that mate in such a manner so as to render the modified contact unusable if the two connectors are unmated.
摘要:
A socket connector for connecting module card to a circuit board includes a housing extending along a longitudinal axis between opposed ends. The housing includes a mounting face configured for mounting on the circuit board and a slot configured to receive a mating edge of the module card. The slot has a bottom surface that defines a seating plane for the mating edge of the module card. An extractor is pivotably connected to at least one of the opposed ends. The extractor includes a foot having a card engagement surface that is relatively higher than the bottom surface when the extractor is in a closed position.
摘要:
An electrical connector including a housing having a mating interface and a contact interface configured to receive an end of a flexible printed circuit (FPC) having at least one row of FPC contacts, and contacts received in the housing and extending between the mating interface and the contact interface. Each of the contacts being configured to engage a corresponding one of the FPC contacts. An insert member is received within the housing. The insert member includes individual fingers moving independently with respect to one another, and the insert member is configured to be loaded into the housing to a mated position at which each of the fingers separately engage the FPC.
摘要:
An electrical connector has been provided that includes a housing having a base having a rear end and an interface end. The base includes at least one channel extending between the rear and interface ends. The electrical connector also includes at least one conductive wafer configured to engage electrical contacts. Each conductive wafer is divided into a rear portion and an interface portion. The rear portion is received and securely retained in a channel with the interface portion extending beyond the interface end of the base. The interface portion moves in a direction transverse to a plane of the conductive wafer to facilitate alignment with a mating structure.
摘要:
The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.
摘要:
A socket for an electronic package comprises a dielectric housing having contacts each with a surface mount section extending below a bottom surface of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section of each contact has a convex bottom surface with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package. A contact having a convex bottom surface which simulates a solder ball is also disclosed
摘要:
The assembly of an electronic package, a socket which holds the package, an electrically-conductive heat sink placed over and around the package, and an EMI shield for minimizing EMI leakage. The shield is a metal frame extending around the socket and package, and secured to it by locking tabs extending inwardly from the frame to detents on the edges of the socket. The socket contains double-wall structures spaced along its periphery which support the frame when it is on the socket, and the heat sink is provided with depending skirts which extend downwardly on all sides of the socket and package, to contribute additional EMI shielding. The sink is held to the socket by resilient retainers, each secured at one end to an upper surface of the heat sink and extending downwardly through the heat sink to be releasably secured to latching detents on the edges of the socket, by means of latches located inside the frame. The double-wall structures hold the frame outward from the latching detents sufficiently that the latches of the retainer fit between the edges of the socket and the inside of the frame.
摘要:
A biasing device for card edge connectors. More particularly, the biasing device is formed from suitable materials and includes as an integral part thereof a spring member which biases the device in the connector.