发明授权
- 专利标题: Printed circuit board test access point structures and method for making the same
- 专利标题(中): 印刷电路板测试接入点结构及其制作方法
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申请号: US10670649申请日: 2003-09-24
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公开(公告)号: US07307222B2公开(公告)日: 2007-12-11
- 发明人: Kenneth P. Parker , Ronald J. Peiffer , Glen E. Leinbach
- 申请人: Kenneth P. Parker , Ronald J. Peiffer , Glen E. Leinbach
- 申请人地址: US CA Santa Clara
- 专利权人: Agilent Technologies, Inc.
- 当前专利权人: Agilent Technologies, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01R12/04
- IPC分类号: H01R12/04 ; H05K1/11 ; G01R31/02
摘要:
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along an x-y plane, the z-dimension is used to implement test access point structures. Each test access point structure is conductively connected to a trace at a test access point directly on top of the trace and along the z axis of the x-, y-, z-coordinate system above an exposed surface of the printed circuit board to be accessible for electrical probing by an external device.
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