公开(公告)号：US07307222B2

公开(公告)日：2007-12-11

申请号：US10670649

申请日：2003-09-24

申请人： Kenneth P. Parker ,  Ronald J. Peiffer ,  Glen E. Leinbach

发明人： Kenneth P. Parker ,  Ronald J. Peiffer ,  Glen E. Leinbach

IPC分类号： H01R12/04 ,  H05K1/11 ,  G01R31/02

CPC分类号： H05K1/0268 ,  G01R31/2805 ,  G01R31/2818 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0989 ,  H05K2203/043

摘要： A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along an x-y plane, the z-dimension is used to implement test access point structures. Each test access point structure is conductively connected to a trace at a test access point directly on top of the trace and along the z axis of the x-, y-, z-coordinate system above an exposed surface of the printed circuit board to be accessible for electrical probing by an external device.

摘要翻译： 介绍了一种用于访问印刷电路板测试点的测试接入点结构及其制造方法。 在沿x-y平面打印痕迹的x，y，z坐标系中，z维用于实现测试接入点结构。 每个测试接入点结构在测试接入点处直接连接到轨迹顶部的迹线上，并且沿x，y，z坐标系的z轴在印刷电路板的暴露表面上导电连接为 可通过外部设备进行电气探测。

公开(公告)号：US20080083816A1

公开(公告)日：2008-04-10

申请号：US11542907

申请日：2006-10-04

申请人： Glen E. Leinbach ,  Stacy Kalisz Johnson

发明人： Glen E. Leinbach ,  Stacy Kalisz Johnson

IPC分类号： B23K31/00

CPC分类号： B23K3/0638 ,  B23K2101/42 ,  H05K1/0269 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2203/163

摘要： Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the data with a plurality of solder paste stenciling process problems to identify at least one solder paste stenciling process problem in the solder paste stenciling process.

摘要翻译： 用于改进焊膏模板工艺的方法和系统包括获得关于印刷电路板上的焊膏沉积物的数据，通过焊膏模板工艺沉积的焊膏沉积通过焊膏模板的多个相同的孔，统计分析数据， 并将数据与多个焊膏模版工艺问题相关联，以识别焊膏模版工艺中的至少一种焊膏模版工艺问题。

公开(公告)号：US06911738B2

公开(公告)日：2005-06-28

申请号：US10694104

申请日：2003-10-27

申请人： Glen E. Leinbach

发明人： Glen E. Leinbach

IPC分类号： H01L23/498 ,  H05K1/02 ,  H05K3/34 ,  H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K2201/09427 ,  Y02P70/613 ,  H01L2924/00

摘要： An assembly and method for detecting defective and open solder joints of an area array packages attached to a printed circuit assembly is presented. The assembly employs offset pad layout on either or both of the printed circuit assembly or the area array package allowing improved solder joint defect detection.

摘要翻译： 提出了一种用于检测附着到印刷电路组件的区域阵列封装的有缺陷且开放的焊点的组件和方法。 组件在印刷电路组件或区域阵列封装中的任一个或两者上采用偏移焊盘布局，从而允许改进的焊点缺陷检测。