摘要:
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along an x-y plane, the z-dimension is used to implement test access point structures. Each test access point structure is conductively connected to a trace at a test access point directly on top of the trace and along the z axis of the x-, y-, z-coordinate system above an exposed surface of the printed circuit board to be accessible for electrical probing by an external device.
摘要:
A method of testing series passive components in electronic assemblies. Only one test pin per passive component is required, thereby reducing the cost and complexity of test fixtures and the electronic assemblies. A passive component is connected between the output of a driving circuit and (optionally) an input of a receiving circuit. The output of the driving circuit is placed in a low impedance state. The receiving end of the passive component is stimulated and the response is measured. For reactive components, the stimulus and response are AC. For resistors, multiple DC measurements may be made. A optional DC bias may be provided to limit DC current and to further reduce the small signal output impedance of the driving circuit.
摘要:
A method of testing for shorts between nodes of a circuit assembly includes parsing circuit design data to identify positional data for nodes of a circuit assembly, and using the positional data to classify ones of the nodes as members of a supernode, where each member of the supernode is unlikely to be shorted to any other member of the supernode. Tests for shorts in a set of nodes that includes the supernode and a plurality of other nodes of the circuit assembly are then conducted, by iteratively i) stimulating a particular one of the set of nodes, and ii) while stimulating the particular node, grounding at least one other node in the set of nodes and monitoring a current flow through the particular node. When stimulating or grounding a supernode, all of the nodes that are members of the supernode are stimulated or grounded. If a current flow is detected through one of the stimulated nodes, the circuit assembly is indicated to be defective. Other embodiments are also disclosed.
摘要:
A layout independent test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. Each test access point structure is conductively connected to various locations along a trace at a test access point and above an exposed surface of the printed circuit board to be accessible for probing by a fixture probe.
摘要:
A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a non-contact connector test probe for a testing a connector of the circuit assembly. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, connector pins of a connector on the circuit assembly are capacitively coupled to a non-contact connector test probe, and an electrical characteristic is measured by a tester coupled to the non-contact connector test probe to determine continuity of electrical paths through the circuit assembly.
摘要:
A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a test facilitating shipping and handling cover for a socket of the circuit assembly. The test facilitating shipping and handling cover may have a conductive layer for capacitively coupling to an array of pins in the socket during testing. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, contacts of a socket on the circuit assembly are capacitively coupled with a conductive layer of a shipping and handling cover mated with the socket, and an electrical characteristic is measured by a tester coupled to the shipping and handling cover to determine continuity of electrical paths through the circuit assembly.
摘要:
Techniques for automating probing location selection during printed circuit board (PCB) and corresponding PCB tester fixture design are presented. The invention includes a system and algorithm for selecting a probe layout comprising a set of probing locations for a printed circuit board design having a plurality of nets, at least some of which have a number of alternative possible probing locations. The system and algorithm iteratively generates a potential probe layout comprising one or more probing locations per net, and based on the potential probe layout, determines one or more regions of maximum deflection. A probing location from the potential probe layout that is located in a region of maximum deflection and is associated with a net having one or more alternative probing locations is removed from the potential probe layout and replaced in the with one of the one or more alternate probing locations associated with the net. Regions of maximum deflection are recalculated based on the modified potential probe layout, and the replacement process is repeated until respective magnitudes of the respective areas of maximum deflection are below a threshold value.
摘要:
A method and apparatus is presented for gaining socket testability through the use of a capacitive interposer engineered to create capacitive coupling between signal nodes of a circuit assembly that the tester has access to and nodes of the socket that would not otherwise have any coupling to a testable signal node of the socket. Generally, coupling capacitance is engineered into the interposer by trace and via routing between the signal node of the socket and a location in close proximity to the inaccessible socket node such that their proximity to each other couples them together.
摘要:
Non-contact connectivity testing of joints connecting circuit junctions are improved through knowledge of characteristics of semiconductor junctions connected to component nodes of components of a device under test (DUT) to allow detection of high-impedance joints.
摘要:
A method and apparatus for detecting shorts between accessible and inaccessible signal nodes (e.g., integrated circuit pins) of an electrical device (e.g., an integrated circuit), using capacitive lead frame technology is presented. In accordance with the method of the invention, an accessible node under test is stimulated with a known source signal. A capacitive sense plate is capacitively coupled to at least one of the accessible node and inaccessible node of the electrical device, and a measuring device coupled to the capacitive sense plate capacitively senses a signal present on the at least one of the accessible node and inaccessible node of the electrical device. Based on the value of the capacitively sensed signal, a known expected “defect-free” capacitively sensed signal measurement and/or a known expected “shorted” capacitively sensed signal measurement, one can determine whether a short fault exists between the accessible node and inaccessible node of the electrical device.