Invention Grant
- Patent Title: Nanowire interconnection and nano-scale device applications
- Patent Title (中): 纳米线互连和纳米级器件应用
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Application No.: US10982051Application Date: 2004-11-05
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Publication No.: US07307271B2Publication Date: 2007-12-11
- Inventor: M. Saif Islam , Philip J. Kuekes , Shih-Yuan Wang , Duncan R. Stewart , Shashank Sharma
- Applicant: M. Saif Islam , Philip J. Kuekes , Shih-Yuan Wang , Duncan R. Stewart , Shashank Sharma
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/036

Abstract:
A nano-colonnade structure-and methods of fabrication and interconnection thereof utilize a nanowire column grown nearly vertically from a (111) horizontal surface of a semiconductor layer to another horizontal surface of another layer to connect the layers. The nano-colonnade structure includes a first layer having the (111) horizontal surface; a second layer having the other horizontal surface; an insulator support between the first layer and the second layer that separates the first layer from the second layer. A portion of the second layer overhangs the insulator support, such that the horizontal surface of the overhanging portion is spaced from and faces the (111) horizontal surface of the first layer. The structure further includes a nanowire column extending nearly vertically from the (111) horizontal surface to the facing horizontal surface, such that the nanowire column connects the first layer to the second layer.
Public/Granted literature
- US20060097389A1 Nanowire interconnection and nano-scale device applications Public/Granted day:2006-05-11
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