Invention Grant
- Patent Title: Plasma-assisted joining
- Patent Title (中): 等离子辅助加入
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Application No.: US10971180Application Date: 2004-10-21
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Publication No.: US07309843B2Publication Date: 2007-12-18
- Inventor: Devendra Kumar , Satyendra Kumar
- Applicant: Devendra Kumar , Satyendra Kumar
- Applicant Address: US MA N. Billerica
- Assignee: BTU International, Inc.
- Current Assignee: BTU International, Inc.
- Current Assignee Address: US MA N. Billerica
- Agency: Weingarten, Schurgin, Gagnebin & Lebovici LLP
- Main IPC: B23K9/02
- IPC: B23K9/02

Abstract:
Methods and apparatus for plasma-assisted joining of one or more parts together are provided. The joining process may include, for example, placing at least first and second joining areas in proximity to one another in a cavity, forming a plasma in the cavity by subjecting a gas to electromagnetic radiation in the presence of a plasma catalyst, and sustaining the plasma at least until the first and second joining areas are joined. Plasma catalysts, and methods and apparatus for igniting, modulating, and sustaining a joining plasma, are provided. Additional cavity shapes, and methods and apparatus for selective plasma-joining, are also provided.
Public/Granted literature
- US20050061446A1 Plasma-assisted joining Public/Granted day:2005-03-24
Information query
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