发明授权
- 专利标题： Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method
- 专利标题（中）： 将端子安装在印刷电路板上的方法，端子安装的印刷电路板和容纳端子安装的印刷电路板的电气接线盒
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申请号： US11206181申请日： 2005-08-18
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公开(公告)号： US07311241B2公开(公告)日： 2007-12-25
- 发明人: Shunji Taga , Kazuhiro Nakanishi
- 申请人： Shunji Taga , Kazuhiro Nakanishi
- 申请人地址： JP Mie JP Osaka
- 专利权人： Sumitomo Wiring Systems, Ltd.,Daihatsu Motor Co., Ltd.
- 当前专利权人： Sumitomo Wiring Systems, Ltd.,Daihatsu Motor Co., Ltd.
- 当前专利权人地址： JP Mie JP Osaka
- 代理机构： Oliff & Berridge, PLC
- 优先权： JPP2004-239085 20040819
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; H05K3/34
摘要：
A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowing nozzles solders soldered portion of the first terminal groups to a first conductor on a back side of the printed board, then the printed board is turned upside down to put the second terminal groups in an upward facing state and to use a jig to shield the first terminal groups facing downward, and solder jetted from the solder blowing nozzles solders soldered portion of the second terminal groups to a second conductor on a front side of the printed board.
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