发明授权
- 专利标题： Process for refining crude resin for electronic material
- 专利标题（中）： 电解材料粗树脂精制工艺
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申请号： US10543263申请日： 2004-01-28
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公开(公告)号： US07312015B2公开(公告)日： 2007-12-25
- 发明人: Hideo Hada , Takeshi Iwai , Masaru Takeshita , Ryotaro Hayashi , Masaaki Muroi , Kota Atsuchi , Hiroaki Tomida , Kazuyuki Shiotani
- 申请人： Hideo Hada , Takeshi Iwai , Masaru Takeshita , Ryotaro Hayashi , Masaaki Muroi , Kota Atsuchi , Hiroaki Tomida , Kazuyuki Shiotani
- 申请人地址： JP Kawasaki-shi
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kawasaki-shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2003-020584 20030129; JP2003-409329 20031208
- 国际申请： PCT/JP2004/000776 WO 20040128
- 国际公布： WO2004/067688 WO 20040812
- 主分类号： G03C1/76
- IPC分类号： G03C1/76 ; G03C1/492 ; G03C1/494 ; C08F6/00 ; C08J3/00
摘要：
A process is provided for effectively removing by-products such as oligomers contained within a crude resin for an electronic material, thus producing a resin for an electronic material. In this process, a crude resin for an electronic material containing (a1) structural units derived from a (meth)acrylate ester with a hydrophilic site is washed using (b1) an organic solvent which is capable of dissolving said crude resin for an electronic material and which separates into two layers when combined with water, and (b2) water.
公开/授权文献
- US20060141384A1 Process for refining crude resin for electronic material 公开/授权日：2006-06-29
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