Invention Grant
- Patent Title: Method and apparatus for manufacturing ultra fine three-dimensional structure
- Patent Title (中): 用于制造超细三维结构的方法和装置
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Application No.: US10220895Application Date: 2001-11-27
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Publication No.: US07326445B2Publication Date: 2008-02-05
- Inventor: Takashi Kaito
- Applicant: Takashi Kaito
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2000-363573 20001129
- International Application: PCT/JP01/10346 WO 20011127
- International Announcement: WO02/44079 WO 20020606
- Main IPC: C23C16/26
- IPC: C23C16/26 ; C23C16/48 ; C23C14/48

Abstract:
A method is adopted for deposition technology using a focused ion beam device, characterized by enabling structures to be formed by using phenanthrene as a source gas and using ions of gallium or gold, silicon or beryllium etc. of energies of 5 to 100 keV from a liquid-metal ion source as ions so as to give a gas blowing density of five to ten times greater than the case of deposition in the related art, with directionality of the gas blowing being both isotropic and symmetrical.
Public/Granted literature
- US20030161970A1 Method and apparatus for manufacturing ultra fine three-dimensional structure Public/Granted day:2003-08-28
Information query
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