发明授权
- 专利标题: Method for manufacturing circuit board with built-in electronic components
- 专利标题(中): 制造具有内置电子部件的电路板的方法
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申请号: US11453790申请日: 2006-06-15
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公开(公告)号: US07328504B2公开(公告)日: 2008-02-12
- 发明人: Seung Gu Kim , Chang Sup Ryu , Han Seo Cho , Doo Hwan Lee , Hwa Sun Park
- 申请人: Seung Gu Kim , Chang Sup Ryu , Han Seo Cho , Doo Hwan Lee , Hwa Sun Park
- 申请人地址: KR Kyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd
- 当前专利权人地址: KR Kyunggi-Do
- 代理机构: Gottlieb, Rackman & Reisman, P.C.
- 优先权: KR10-2005-0061370 20050707
- 主分类号: H05K3/30
- IPC分类号: H05K3/30 ; H05K3/34 ; H01K3/10
摘要:
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.