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    Method for manufacturing circuit board with built-in electronic components
    4.
    发明授权
    Method for manufacturing circuit board with built-in electronic components 失效
    制造具有内置电子部件的电路板的方法

    公开(公告)号：US07328504B2

    公开(公告)日：2008-02-12

    申请号：US11453790

    申请日：2006-06-15

    申请人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

    发明人： Seung Gu Kim ,  Chang Sup Ryu ,  Han Seo Cho ,  Doo Hwan Lee ,  Hwa Sun Park

    IPC分类号： H05K3/30 ,  H05K3/34 ,  H01K3/10

    CPC分类号： H05K1/188 ,  H05K1/185 ,  H05K2201/0355 ,  H05K2201/10674 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

    摘要： Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member (S120), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S130), step for forming copper cladding coated with an adhesive on the insulating member (S140), step for applying heat and/or pressure to the copper cladding (S150), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S160). The step (S150) can comprise a step (S240) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S250) for applying copper cladding on respective surfaces of the inter-adhesive.

    摘要翻译： 公开了一种制造电路板的方法，包括在其下表面上制备绝缘构件和具有位置设定装置的电子部件的步骤（S110），用于在绝缘构件中形成安装孔的步骤（S120）， 步骤，用于将所述电子部件安装在所述绝缘部件上以满足所述位置设定装置和所述安装孔（S130），用于在所述绝缘部件上形成涂覆有粘合剂的铜包层的步骤（S140），用于施加热和/ 或对铜包层的压力（S150），以及用于在铜包层中形成电气连接到电子部件的通孔的步骤，以及用于在铜包层中形成电路图案的步骤（S160）。 步骤（S150）可以包括用于在绝缘构件的相应表面上施加粘合剂的步骤（S 240），以及用于在粘合剂的各个表面上施加铜包层的台阶（S 250）。

    Package board, semiconductor package, and fabricating method thereof
    5.
    发明授权
    Package board, semiconductor package, and fabricating method thereof 有权
    封装板，半导体封装及其制造方法

    公开(公告)号：US07592708B2

    公开(公告)日：2009-09-22

    申请号：US11528324

    申请日：2006-09-28

    申请人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Yong-Bin Lee ,  Yoo-Keum Wee ,  Seok-Hwan Huh ,  Chang-Sup Ryu

    发明人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Yong-Bin Lee ,  Yoo-Keum Wee ,  Seok-Hwan Huh ,  Chang-Sup Ryu

    IPC分类号： H01L21/31 ,  H01L21/469

    CPC分类号： H01L21/563 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01078

    摘要： With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board and having at least one bump attached to at least a portion of the circuit lines, where the solder resist comprises a perimeter groove, which exposes at least a portion of the circuit lines, and an extension groove, which is connected to the perimeter groove, and where encapsulant is filled in the perimeter groove and the extension groove, the filling characteristics of the encapsulant is improved for greater reliability in the electrical connections between the chip and the board.

    摘要翻译： 根据本发明的一个方面的半导体封装，其包括具有电路线的板，形成在所述板的表面上的阻焊剂和安装在所述板上的芯片，并且具有附着到所述板的至少一部分上的至少一个凸块 电路线，其中阻焊剂包括暴露至少一部分电路线的周边凹槽和连接到周边凹槽的延伸凹槽，并且其中密封剂填充在周边凹槽和延伸凹槽中， 提高了密封剂的填充特性，以便在芯片和电路板之间的电连接中获得更高的可靠性。

    METHOD AND APPARATUS FOR GENERATING INTERPOLATED FRAME BETWEEN ORIGINAL FRAMES
    6.
    发明申请
    METHOD AND APPARATUS FOR GENERATING INTERPOLATED FRAME BETWEEN ORIGINAL FRAMES 有权
    用于在原始框架之间产生插值框架的方法和装置

    公开(公告)号：US20120314770A1

    公开(公告)日：2012-12-13

    申请号：US13284342

    申请日：2011-10-28

    申请人： Seung-gu KIM ,  Tae-gyoung AHN ,  Se-hyeok PARK ,  Young-ho MOON

    发明人： Seung-gu KIM ,  Tae-gyoung AHN ,  Se-hyeok PARK ,  Young-ho MOON

    IPC分类号： H04N7/26

    CPC分类号： H04N19/59 ,  H04N19/132 ,  H04N19/184 ,  H04N19/48 ,  H04N19/51 ,  H04N19/587

    摘要： A method and apparatus for generating an interpolated frame are provided. The method includes: generating a motion vector for generating a third frame by performing motion estimation based on first image data and second image data, the first image data being a portion of image data of a first frame and the second image data being a portion of image data of a second frame; restoring the image data of the first frame based on the first image data and the image data of the second frame based on the second image data; and generating the third frame by performing motion compensation based on at least one of the restored image data of the first frame and the restored image data of the second frame and the generated motion vector.

    摘要翻译： 提供了一种用于生成内插帧的方法和装置。 该方法包括：通过基于第一图像数据和第二图像数据执行运动估计来产生用于生成第三帧的运动矢量，第一图像数据是第一帧的图像数据的一部分，第二图像数据是 第二帧的图像数据; 基于第二图像数据，基于第一图像数据和第二帧的图像数据恢复第一帧的图像数据; 以及通过基于第一帧的恢复图像数据和第二帧的恢复图像数据和所生成的运动矢量中的至少一个执行运动补偿来生成第三帧。

    Printed circuit board and manufacturing method thereof
    8.
    发明申请
    Printed circuit board and manufacturing method thereof 失效
    印刷电路板及其制造方法

    公开(公告)号：US20070074900A1

    公开(公告)日：2007-04-05

    申请号：US11528322

    申请日：2006-09-28

    申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

    发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

    IPC分类号： H05K1/16

    CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

    摘要： A printed circuit board and manufacturing method thereof are disclosed. By use of a method of manufacturing a printed circuit board, which uses a metal substrate as a core member and has an electronic component embedded in the metal substrate, mainly comprising: (a) anodizing at least one surface of the metal substrate to form at least one insulation layer, (b) forming an inner layer circuit on the at least one insulation layer, (d) placing chip bond adhesive in correspondence with a position where the electronic component is to be embedded and mounting the electronic component, and (e) forming an outer layer circuit in correspondence with a position where the inner layer circuit is formed and with positions of the electrodes of the electronic component, and which may further comprise an operation (c) of etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded between the operations (b) and (d), a metal substrate, such as that of aluminum, etc., is rendered electrically insulating by applying an anodizing process and is used as a core member in a printed circuit board, so that bending stiffness and heat-releasing property are improved; wet etching can be applied, so that manufacturing costs are reduced; and a chip bond adhesive, die attach film, or nonconductive paste, etc., that is high in thixotropy is used in embedding the electronic component, so that the degree of precision may be increased for the position and height of the electronic component when embedding the electronic component.

    摘要翻译： 公开了一种印刷电路板及其制造方法。 通过使用制造印刷电路板的方法，该印刷电路板使用金属基板作为核心部件并且具有嵌入金属基板中的电子部件，其主要包括：（a）阳极氧化金属基板的至少一个表面以形成 至少一个绝缘层，（b）在所述至少一个绝缘层上形成内层电路，（d）将芯片粘结粘合剂放置在与要嵌入电子元件的位置相对应并安装电子元件的位置 ）形成与形成内层电路的位置对应的外层电路和电子部件的电极的位置，并且还可以包括蚀刻金属基板以形成相应的空腔的操作（c） 具有将电子部件嵌入在操作（b）和（d）之间的位置，诸如铝等的金属基板通过ap被电绝缘 采用阳极氧化工艺，用作印刷电路板中的芯材，改善了弯曲刚度和散热性能; 可以应用湿蚀刻，从而降低制造成本; 并且在嵌入电子部件时使用具有高触变性的芯片接合粘合剂，芯片附着膜或非导电浆料等，使得当嵌入时电子部件的位置和高度的精度可以增加 电子元件。

    Method and apparatus for generating interpolated frame between original frames
    10.
    发明授权
    Method and apparatus for generating interpolated frame between original frames 有权
    用于在原始帧之间生成内插帧的方法和装置

    公开(公告)号：US09014272B2

    公开(公告)日：2015-04-21

    申请号：US13284342

    申请日：2011-10-28

    申请人： Seung-gu Kim ,  Tae-gyoung Ahn ,  Se-hyeok Park ,  Young-ho Moon

    发明人： Seung-gu Kim ,  Tae-gyoung Ahn ,  Se-hyeok Park ,  Young-ho Moon

    IPC分类号： H04N7/26 ,  H04N19/59 ,  H04N19/51 ,  H04N19/132 ,  H04N19/184 ,  H04N19/48 ,  H04N19/587

    CPC分类号： H04N19/59 ,  H04N19/132 ,  H04N19/184 ,  H04N19/48 ,  H04N19/51 ,  H04N19/587

    摘要： A method and apparatus for generating an interpolated frame are provided. The method includes: generating a motion vector for generating a third frame by performing motion estimation based on first image data and second image data, the first image data being a portion of image data of a first frame and the second image data being a portion of image data of a second frame; restoring the image data of the first frame based on the first image data and the image data of the second frame based on the second image data; and generating the third frame by performing motion compensation based on at least one of the restored image data of the first frame and the restored image data of the second frame and the generated motion vector.

    摘要翻译： 提供了一种用于生成内插帧的方法和装置。 该方法包括：通过基于第一图像数据和第二图像数据执行运动估计来产生用于生成第三帧的运动矢量，第一图像数据是第一帧的图像数据的一部分，第二图像数据是 第二帧的图像数据; 基于第二图像数据，基于第一图像数据和第二帧的图像数据恢复第一帧的图像数据; 以及通过基于第一帧的恢复图像数据和第二帧的恢复图像数据和所生成的运动矢量中的至少一个执行运动补偿来生成第三帧。