Invention Grant
US07341065B2 Single wafer cleaning method to reduce particle defects on a wafer surface
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单晶圆清洗方法可减少晶圆表面的颗粒缺陷
- Patent Title: Single wafer cleaning method to reduce particle defects on a wafer surface
- Patent Title (中): 单晶圆清洗方法可减少晶圆表面的颗粒缺陷
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Application No.: US11497182Application Date: 2006-07-31
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Publication No.: US07341065B2Publication Date: 2008-03-11
- Inventor: Steven Verhaverbeke , Christopher Laurent Beaudry
- Applicant: Steven Verhaverbeke , Christopher Laurent Beaudry
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman
- Main IPC: B08B6/00
- IPC: B08B6/00 ; C25F1/00 ; C25F3/00 ; C25F5/00
Abstract:
Methods of preventing air-liquid interfaces on the surface of a wafer in order to prevent the formation of particle defects on a wafer are presented. The air-liquid interfaces may be prevented by covering the entire surface of the wafer with liquid at all times during a cleaning process while the surface of the wafer is hydrophobic. Methods of preventing the formation of silica agglomerates in a liquid during a pH transition from an alkaline pH to a neutral pH are also presented, including minimizing the turbulence in the liquid solution and reducing the temperature of the liquid solution during the transition.
Public/Granted literature
- US20060261038A1 Single wafer cleaning method to reduce particle defects on a wafer surface Public/Granted day:2006-11-23
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