发明授权
- 专利标题： Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
- 专利标题（中）： 发光二极管，光半导体装置，适用于光半导体装置的环氧树脂组合物及其制造方法
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申请号： US11148339申请日： 2005-06-09
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公开(公告)号： US07342357B2公开(公告)日： 2008-03-11
- 发明人: Kensho Sakano , Kazuhiko Sakai , Yuji Okada , Toshihiko Umezu
- 申请人： Kensho Sakano , Kazuhiko Sakai , Yuji Okada , Toshihiko Umezu
- 申请人地址： JP Tokushima
- 专利权人： Nichia Corporation
- 当前专利权人： Nichia Corporation
- 当前专利权人地址： JP Tokushima
- 代理机构： Morrison & Foerster LLP
- 优先权： JP2001-016367 20010124; JP2001-024794 20010131; JP2001-045659 20010221; JP2001-078322 20010319; JP2001-10924 20010330; JP2001-301833 20010928; JP2001-302390 20010928; JP2001-306707 20011002
- 主分类号： H01J1/62
- IPC分类号： H01J1/62
摘要：
A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
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