Invention Grant
- Patent Title: Apparatus and method for SIMD modular multiplication
- Patent Title (中): SIMD模数乘法的装置和方法
-
Application No.: US10137560Application Date: 2002-05-02
-
Publication No.: US07343389B2Publication Date: 2008-03-11
- Inventor: William W. Macy , Hong Jiang , Eric Debes , Igor V. Kozintsev
- Applicant: William W. Macy , Hong Jiang , Eric Debes , Igor V. Kozintsev
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F7/38
- IPC: G06F7/38

Abstract:
An apparatus and method for single instruction multiple data (SIMD) modular multiplication are described. In one embodiment, the method includes selection of modular multiplication method available from an operating environment. Once the multiplication method is selected, a data access pattern for processing of data is selected. Finally, the selected modular multiplication method is executed in order to process data according to the selected data access pattern. In a further embodiment, a SIMD modular multiplication instruction is provided in order to enable simultaneous modular multiplication of multiplicand and multiplier operands, which may be vertically or horizontally accessed from memory, as indicated by a selected data access pattern. Alternatively, modular multiplication is implemented utilizing a SIMD byte shuffle operation, which enables modular multiplication of a constant multiplicand value to varying data multiplier values.
Public/Granted literature
- US20030212727A1 Apparatus and method for SIMD modular multiplication Public/Granted day:2003-11-13
Information query