发明授权
- 专利标题： Conductive adhesive composition
- 专利标题（中）： 导电胶组成
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申请号： US10737748申请日： 2003-12-18
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公开(公告)号： US07345105B2公开(公告)日： 2008-03-18
- 发明人: Masachika Yoshino , Motoo Fukushima , Toshio Shiobara
- 申请人： Masachika Yoshino , Motoo Fukushima , Toshio Shiobara
- 申请人地址： JP Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2002-369889 20021220
- 主分类号： C08J3/00
- IPC分类号： C08J3/00 ; C08K3/08 ; C08L67/00 ; C08L79/00 ; C08L83/00
摘要：
A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.
公开/授权文献
- US20040127626A1 Conductive adhesive composition 公开/授权日：2004-07-01