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    Conductive adhesive composition
    1.
    发明授权
    Conductive adhesive composition 有权
    导电胶组成

    公开(公告)号：US07345105B2

    公开(公告)日：2008-03-18

    申请号：US10737748

    申请日：2003-12-18

    申请人： Masachika Yoshino ,  Motoo Fukushima ,  Toshio Shiobara

    发明人： Masachika Yoshino ,  Motoo Fukushima ,  Toshio Shiobara

    IPC分类号： C08J3/00 ,  C08K3/08 ,  C08L67/00 ,  C08L79/00 ,  C08L83/00

    CPC分类号： H05K3/321 ,  H05K2201/0245

    摘要： A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.

    摘要翻译： 通过将粘合剂树脂与基于作为导电剂的银粉的粘合剂组合物以30-98重量％混合来获得导电粘合剂组合物。 银粉含有由平坦的一次粒子构成的银粉，其具有大量的聚集体结构，并且基于粘合剂的30-198重量％的振实密度为0.1-1.5克/厘米3 组成。 导电性粘合剂组合物固化成具有改善的导电性，粘附性，耐热性，耐湿性，加工和热传递容易性的产品。

    Light-emitting semiconductor potting composition and light-emitting semiconductor device
    4.
    发明授权
    Light-emitting semiconductor potting composition and light-emitting semiconductor device 有权
    发光半导体封装组合物和发光半导体器件

    公开(公告)号：US06806509B2

    公开(公告)日：2004-10-19

    申请号：US10797139

    申请日：2004-03-11

    申请人： Masachika Yoshino ,  Toshio Shiobara

    发明人： Masachika Yoshino ,  Toshio Shiobara

    IPC分类号： H01L3300

    CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K5/54 ,  C08L83/04 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A potting composition comprising (A) an organopolysiloxane having a vinyl group at an end of its molecular chain, (B) an organohydrogenpolysiloxane, (C) a platinum group metal catalyst, and optionally, (D) an organosilicon compound having a silicon atom-bonded alkoxy group. The cured product of the composition has a refractive index of 1.41-1.56 at 25° C. and 589 nm (sodium D line). The composition is suited for the embedment and protection of light-emitting semiconductor members. A package in which a light-emitting semiconductor member is embedded and protected with the potting composition undergoes little discoloration and maintains a high emission efficiency in heating tests, thus offering a light-emitting semiconductor device featuring a long life and energy saving.

    摘要翻译： 一种灌封组合物，其包含（A）在其分子链末端具有乙烯基的有机聚硅氧烷，（B）有机氢聚硅氧烷，（C）铂族金属催化剂和任选的（D）具有硅原子的有机硅化合物， 键合的烷氧基。 组合物的固化产物在25℃和589nm（D线）的折射率为1.41-1.56。 该组合物适用于发光半导体部件的嵌入和保护。 通过灌封组合物嵌入和保护发光半导体部件的封装几乎不发生变色，并且在加热试验中保持高发光效率，因此提供了具有长寿命和节能的发光半导体器件。

    Corrosion-resistant copper materials and making method
    5.
    发明授权
    Corrosion-resistant copper materials and making method 失效
    耐腐蚀铜材及其制作方法

    公开(公告)号：US6103026A

    公开(公告)日：2000-08-15

    申请号：US54448

    申请日：1998-04-03

    申请人： Masachika Yoshino ,  Toshio Shiobara ,  Naoya Noguchi

    发明人： Masachika Yoshino ,  Toshio Shiobara ,  Naoya Noguchi

    IPC分类号： C22C9/10 ,  C23C8/06 ,  C23C26/00 ,  C22C9/00

    CPC分类号： C23C26/00 ,  C23C8/06 ,  Y10T428/12021 ,  Y10T428/12903

    摘要： A corrosion-resistant copper material has a surface layer of a copper alloy containing 10-50 at % (i.e. % by atom) of silicon and of 10-1,000 .ANG. thick. It is produced simply by annealing a copper material containing 0.01-5 at % of silicon at 100-600.degree. C. in a hydrogen-containing gas. Because of its excellent resistance to surface corrosion due to heat and aging, the resulting copper material lends itself well to automotive and electrical applications requiring heat resistance, and is also suitable for use in electrical wire and in leadframes for semiconductor devices.

    摘要翻译： 耐腐蚀铜材料具有包含10-50原子％（即原子％）硅和10-1000埃格姆库姆厚度的铜合金的表面层。 它通过在含氢气体中在100-600℃下退火含有0.01-5at％的硅的铜材料来简单地制备。 由于其耐热老化对表面腐蚀性能优良，因此所得铜材料适用于要求耐热性的汽车和电气应用，并且也适用于电线和半导体器件的引线框。

    Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
    9.
    发明授权
    Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus 有权
    含有纤维的树脂基板，其上安装有半导体装置的密封基板，其上形成有半导体装置的密封晶片，半导体装置和半导体装置的制造方法

    公开(公告)号：US08823186B2

    公开(公告)日：2014-09-02

    申请号：US13301035

    申请日：2011-11-21

    申请人： Susumu Sekiguchi ,  Toshio Shiobara

    发明人： Susumu Sekiguchi ,  Toshio Shiobara

    IPC分类号： H01L23/29

    CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/293 ,  H01L24/97 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T442/2041 ,  H01L2924/00

    摘要： A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includes: a resin-impregnated fiber base material obtained by impregnating a fiber base material with a thermosetting resin and semi-curing or curing the thermosetting resin; and an uncured resin layer containing an uncured thermosetting resin and formed on one side of the resin-impregnated fiber base material. There can be a fiber-containing resin substrate that enables suppressing warp of a wafer and delamination of semiconductor devices even though a large-diameter wafer or a large-diameter substrate made of a metal and the like is sealed, enables collectively sealing a semiconductor devices mounting surface of the substrate or a semiconductor devices forming surface of the wafer, and has excellent heat resistance or moisture resistance after sealing.

    摘要翻译： 用于共同密封其上安装有半导体器件的基板的半导体器件安装表面或形成有半导体器件的形成表面的半导体器件的含纤维树脂基板包括：通过浸渍获得的树脂浸渍的纤维基材 具有热固性树脂并半固化或固化所述热固性树脂的纤维基材; 以及未固化的树脂层，其含有未固化的热固性树脂，并且在树脂浸渍的纤维基材的一侧上形成。 即使由金属等制成的大直径晶片或大直径基板被密封，也可以是能够抑制晶片翘曲和半导体器件分层的含纤维树脂基板，能够集中地密封半导体器件 衬底的安装表面或形成晶片表面的半导体器件，并且在密封后具有优异的耐热性或耐湿性。

    Organopolysilmethylene-siloxane and a cured product thereof
    10.
    发明授权
    Organopolysilmethylene-siloxane and a cured product thereof 有权
    有机聚硅氧烷 - 硅氧烷及其固化物

    公开(公告)号：US08497024B2

    公开(公告)日：2013-07-30

    申请号：US12860682

    申请日：2010-08-20

    申请人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

    发明人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

    IPC分类号： B32B9/04

    CPC分类号： C08G77/50 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  C08L83/14 ,  Y10T428/31663 ,  C08L83/00

    摘要： Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.

    摘要翻译： 式（1）的有机聚硅氧烷 - 硅氧烷：其中每个R 1彼此独立地是除烯基，烷氧基，羟基和卤素以外的未取代或取代的碳原子数1〜10的一价烃基 原子; 每个R 2彼此独立地是除烯基，烷氧基，羟基，卤素原子和（R 1）3 SiCH 2 - 以外具有1至10个碳原子的未取代或取代的一价烃基，其中每个R 3 彼此独立地是氢原子和具有1至4个碳原子的烷基; k为1〜100的整数， n为1〜1000的整数。 所述有机聚硅氧烷 - 硅氧烷在分子中具有至少两个烷氧基，羟基和与一个或多个硅原子键合的卤素原子。