发明授权
- 专利标题: Defect inspecting apparatus and defect inspection method
- 专利标题(中): 缺陷检查装置和缺陷检查方法
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申请号: US11248124申请日: 2005-10-13
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公开(公告)号: US07345755B2公开(公告)日: 2008-03-18
- 发明人: Riki Ogawa , Toru Tojo
- 申请人: Riki Ogawa , Toru Tojo
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2004-300265 20041014
- 主分类号: G01N21/00
- IPC分类号: G01N21/00
摘要:
In a defect inspecting apparatus, an illumination optical system illuminate a mask having a patterned surface, the optical beam passing through the mask is split into two beam components which is guided in first and second image pickup sensors. The pickup sensors has first and second pickup fields on the patterned surface, which pick up first and second parts of the mask image. The first and second pickup fields are parallel to each other and displaced from each other by (2n+1)×d/2 in the longitudinal direction thereof, where d denotes a longitudinal dimension of each pixel image in the first and second pick up fields and n denotes an integer equal to or larger than 0. The first and second parts of the mask image are merged to form a pattern image, and a defect in the mask is detected on the basis of the pattern image.
公开/授权文献
- US20060087649A1 Defect inspecting apparatus and defect inspection method 公开/授权日:2006-04-27
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