发明授权
US07350406B2 Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method
有权
传感器芯片断裂强度检测装置和传感器芯片断裂强度检测方法
- 专利标题： Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method
- 专利标题（中）： 传感器芯片断裂强度检测装置和传感器芯片断裂强度检测方法
-
申请号： US11279606申请日： 2006-04-13
-
公开(公告)号： US07350406B2公开(公告)日： 2008-04-01
- 发明人: Hideki Yabe , Yuichi Sakai , Yoshitatsu Kawama , Munehito Kumagai , Yasuyuki Nakaoka
- 申请人： Hideki Yabe , Yuichi Sakai , Yoshitatsu Kawama , Munehito Kumagai , Yasuyuki Nakaoka
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-354520 20051208
- 主分类号： G01M19/00
- IPC分类号： G01M19/00
摘要：
A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
公开/授权文献
信息查询
