公开(公告)号：US07350406B2

公开(公告)日：2008-04-01

申请号：US11279606

申请日：2006-04-13

申请人： Hideki Yabe ,  Yuichi Sakai ,  Yoshitatsu Kawama ,  Munehito Kumagai ,  Yasuyuki Nakaoka

发明人： Hideki Yabe ,  Yuichi Sakai ,  Yoshitatsu Kawama ,  Munehito Kumagai ,  Yasuyuki Nakaoka

IPC分类号： G01M19/00

CPC分类号： G01N3/08 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0282 ,  G01N2203/0647

摘要： A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.

摘要翻译： 在其上设置有多个具有膜片部分的传感器芯片的半导体晶片上执行传感器芯片断裂强度检查的传感器芯片断裂强度检查装置包括：安装半导体晶片的台阶; 以及以与传感器芯片的标准断裂强度相当的压力将介质发射到传感器芯片上的喷嘴。

公开(公告)号：US5196107A

公开(公告)日：1993-03-23

申请号：US808774

申请日：1991-12-17

申请人： Yasuyuki Nakaoka ,  Minoru Fujita ,  Toshikazu Izumo ,  Tsuyoshi Watanabe

发明人： Yasuyuki Nakaoka ,  Minoru Fujita ,  Toshikazu Izumo ,  Tsuyoshi Watanabe

IPC分类号： C23C18/16 ,  C25D15/00

CPC分类号： C25D15/00 ,  C23C18/1662

摘要： A dispersion plating method in which plating is conducted while plating liquid containing both abrasive grains of a size larger than 10 .mu.m and another grains is brought into contact with the surface of an object to be plated, the latter grains then being removed by washing with water with only abrasive grains being entrapped in a metal matrix. Plating liquid is circulated through a filter of a filtering size smaller than the average grain size of abrasive grains and the abrasive grains are made into a flocculating condition and adhered to the surface of object to be plated. Furthermore, abrasive grains are adhered to the surface of object to be plated in a plating thickness of less than one half of average grain size of abrasive grains.

摘要翻译： 一种分散镀方法，其中在将含有大于10μm的两个磨料颗粒的液体和另一个颗粒与待镀物体的表面接触的同时进行电镀，然后通过用 只有磨粒的水被截留在金属基质中。 电镀液体通过小于磨粒的平均粒径的过滤尺寸的过滤器循环，并且磨粒被制成絮凝状态并粘附到被镀物体的表面。 此外，磨料颗粒以小于磨粒平均粒度的一半的镀层厚度粘附到待镀物体的表面。

公开(公告)号：US20070137310A1

公开(公告)日：2007-06-21

申请号：US11279606

申请日：2006-04-13

申请人： Hideki YABE ,  Yuichi SAKAI ,  Yoshitatsu KAWAMA ,  Munehito KUMAGAI ,  Yasuyuki NAKAOKA

发明人： Hideki YABE ,  Yuichi SAKAI ,  Yoshitatsu KAWAMA ,  Munehito KUMAGAI ,  Yasuyuki NAKAOKA

IPC分类号： G01N3/00

CPC分类号： G01N3/08 ,  G01N2203/0042 ,  G01N2203/0044 ,  G01N2203/0282 ,  G01N2203/0647

摘要： A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.

摘要翻译： 在其上设置有多个具有膜片部分的传感器芯片的半导体晶片上执行传感器芯片断裂强度检查的传感器芯片断裂强度检查装置包括：安装半导体晶片的台阶; 以及以与传感器芯片的标准断裂强度相当的压力将介质发射到传感器芯片上的喷嘴。

公开(公告)号：US06214129B1

公开(公告)日：2001-04-10

申请号：US09177114

申请日：1998-10-22

申请人： Yasuyuki Nakaoka ,  Setsuo Wake ,  Kazuyuki Kan ,  Muneyuki Ishimura

发明人： Yasuyuki Nakaoka ,  Setsuo Wake ,  Kazuyuki Kan ,  Muneyuki Ishimura

IPC分类号： C23G102

CPC分类号： H01L21/02052 ,  B08B3/10 ,  H01L21/67057 ,  Y10S134/902

摘要： A cleaning method to inhibit the adhesion of micro particles to a member to be cleaned by decreasing an amount of generation of bubbles. In a method for cleaning a member to be cleaned by dipping the member into a cleaning bath to which a hydrochloric acid-hydrogen peroxide mixture comprising hydrochloric acid, hydrogen peroxide and water is supplied through a filter and a supplying port; the improvement is that a temperature of the hydrochloric acid, hydrogen peroxide mixture is controlled within the range of 20°to 45° C.

摘要翻译： 一种清洁方法，通过减少气泡产生量来抑制微粒附着到要清洗的构件上。 在通过将构件浸渍到通过过滤器和供给口供给盐酸，过氧化氢和水的盐酸 - 过氧化氢混合物的清洗浴中来清洁要清洁的构件的方法中， 改进之处在于将盐酸，过氧化氢混合物的温度控制在20〜45℃的范围内。