Invention Grant
US07358444B2 Folded substrate with interposer package for integrated circuit devices
有权
用于集成电路器件的带有插入器封装的折叠式衬底
- Patent Title: Folded substrate with interposer package for integrated circuit devices
- Patent Title (中): 用于集成电路器件的带有插入器封装的折叠式衬底
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Application No.: US10964790Application Date: 2004-10-13
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Publication No.: US07358444B2Publication Date: 2008-04-15
- Inventor: Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
- Applicant: Robert M. Nickerson , Ronald L. Spreitzer , John C. Conner , Brian Taggart
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Konrad Raynes & Victor LLP
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
Public/Granted literature
- US20060077644A1 Folded substrate with interposer package for integrated circuit devices Public/Granted day:2006-04-13
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