A printer apparatus is disclosed. The printer apparatus includes a heat dissipation plate structure including a thermally conductive material, and a processor comprising a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor. An array of pins is substantially perpendicular to the major surface of the processor. The apparatus also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly. The apparatus also includes a memory for storing print image data, the memory being operatively coupled to the processor. It also includes a printing unit operatively coupled to the memory for printing on paper.