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公开(公告)号：US07583505B2
公开(公告)日：2009-09-01
申请号：US12016646
申请日：2008-01-18
IPC分类号： H05K7/20
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.
摘要翻译： 公开了一种处理器装置。 该装置包括具有空气通道的壳体和在壳体内具有导热材料的散热板结构。 它包括具有主表面的处理器，其中处理器在通电时产生热量，并且散热板结构适于散发来自处理器的热量。 它还包括引脚阵列，其中引脚阵列中的引脚基本上垂直于处理器的主表面并且可操作地耦合到处理器。 它还包括插座组件和电路板，其中插座组件在电路板上。 引脚阵列中的引脚被配置为接收在插座组件中。
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公开(公告)号：US06404639B1
公开(公告)日：2002-06-11
申请号：US09452625
申请日：1999-12-01
IPC分类号： H05K720
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.
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3.发明授权Cartridge for electronic devices including grounding pads and conductive shielding to decrease the wavelength of emitted electromagnetic radiation 失效用于电子设备的墨盒，包括接地垫和导电屏蔽，以减少发射的电磁辐射的波长
公开(公告)号：US5659459A
公开(公告)日：1997-08-19
申请号：US439633
申请日：1995-05-12
IPC分类号： G06K19/077 , H05K5/02 , G11C5/04 , H05K9/00
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： An add-in or expansion cartridge is provided for insertion into a cartridge receptacle of an electronic device, such as a laser printer, the electronic device comprising a first plurality of circuit elements. The add-in cartridge comprises a circuit board having a second plurality of circuit elements mounted thereon, the circuit board comprising a plurality of grounding pads and connectors for electrically connecting the second plurality of circuit elements, which may include a processor, to the electronic device. A housing accommodates the circuit board and comprises an opening such that the connector extends through the opening for connecting the circuit board through the electronic device. A conductive shielding layer is arranged on at least one interior surface of the housing and substantially surrounds the circuit board to reduce emission of electromagnetic radiation. First and second grounding pads are arranged at first and seconds ends, respectively of the opening. A third grounding pad is arranged between the first and second grounding pads and within the opening to decrease the wavelength of emitted electromagnetic radiation. The conductive shielding layer is in electrical connection with each of the plurality of grounding pads.
摘要翻译： 提供了一种插入式或扩充式盒式磁带，用于插入诸如激光打印机的电子设备的盒式存储器中，该电子设备包括第一组多个电路元件。 附加盒包括具有安装在其上的第二多个电路元件的电路板，电路板包括多个接地焊盘和连接器，用于将可包括处理器的第二多个电路元件电连接到电子设备 。 壳体容纳电路板并且包括开口，使得连接器延伸穿过开口，用于通过电子设备连接电路板。 导电屏蔽层布置在壳体的至少一个内表面上并且基本上围绕电路板以减少电磁辐射的发射。 第一和第二接地垫分别在开口和第二端分别设置。 第三接地垫布置在第一和第二接地焊盘之间并且在开口内，以减小发射的电磁辐射的波长。 导电屏蔽层与多个接地焊盘中的每一个电连接。
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4.发明授权Intelligent cartridge for attachment to a printer to perform image processing tasks in a combination image processing system and method of image processing 失效用于连接到打印机以在组合图像处理系统和图像处理方法中执行图像处理任务的智能盒
公开(公告)号：US5592595A
公开(公告)日：1997-01-07
申请号：US372488
申请日：1995-01-12
申请人： Kenichi Wakabayashi , Kaoru Hatakoshi , Kiyotaka Nishimura , Tsuyoshi Morikawa , Tadashi Shiozaki , Akira Nakajima , Hajime Nishizawa , Chitoshi Takayama
发明人： Kenichi Wakabayashi , Kaoru Hatakoshi , Kiyotaka Nishimura , Tsuyoshi Morikawa , Tadashi Shiozaki , Akira Nakajima , Hajime Nishizawa , Chitoshi Takayama
IPC分类号： G06K15/00
CPC分类号： G06K15/00
摘要： The image processing performance of a present day or existing page printer, e.g., electrophotographic printer, is improved and accelerated with the use of a detachable intelligent cartridge which contains a CPU and necessary memory to process print data into image dated for the electronic control unit of the printer to which the cartridge is attached. Depending, upon the page description language (PDL) to be employed, a cartridge can be selected for use with the printer and accelerate its PDL conversion and printing output. The intelligent cartridge CPU, which is different from the printer CPU, receives print data are from the printer and, since the data bus connecting the intelligent cartridge and the electronic control unit of the printer has only a read only capability from the electronic control unit, data transfer to the cartridge is made possible by utilizing the print data as an index for the read address accomplished by the printer CPU. The bit image data is accomplished by the cartridge CPU from print data received via the printer CPU and after data development, the bit image data is transferred to the printer for hardcopy printout.
摘要翻译： 使用包含CPU的可拆卸智能盒和必要的存储器来处理当前日期或现有页面打印机（例如电子照相打印机）的图像处理性能，并且加速了将可打印数据处理成为日期为图像的电子控制单元 墨盒所连接的打印机。 根据要使用的页面描述语言（PDL），可以选择一个墨盒与打印机一起使用，并加速其PDL转换和打印输出。 与打印机CPU不同的智能墨盒CPU从打印机接收打印数据，并且由于连接智能墨盒和打印机的电子控制单元的数据总线仅具有来自电子控制单元的只读能力， 通过利用打印数据作为由打印机CPU完成的读取地址的索引，可以将数据传送到盒。 位图数据由墨盒CPU从经由打印机CPU接收的打印数据完成，并且在数据开发之后，将位图数据传送到打印机进行硬拷贝打印输出。
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公开(公告)号：US20090284913A1
公开(公告)日：2009-11-19
申请号：US12509644
申请日：2009-07-27
IPC分类号： H05K7/20
CPC分类号： H04L1/0083 , H04L65/4069 , H04L65/607 , H04L65/80
摘要： An apparatus is disclosed. The apparatus includes a processor having a major surface, where the processor generates heat when energized. It also includes a heat dissipation plate comprising a thermally conductive material, and includes a first portion with flat opposing surfaces and a second portion substantially perpendicular to the first portion. The heat dissipation plate is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the flat opposing surfaces of the heat dissipation plate, and a heat dissipating material contacting the heat dissipation plate and the major surface of the processor. The heat dissipating material does not contact the second portion of the heat dissipating plate, and the pins are configured to be received in a socket assembly on a circuit board.
摘要翻译： 公开了一种装置。 该装置包括具有主表面的处理器，其中处理器在通电时产生热量。 它还包括一个包括导热材料的散热板，并且包括具有平坦相对表面的第一部分和基本上垂直于第一部分的第二部分。 散热板适于散发来自处理器的热量。 它还包括引脚阵列，其中引脚阵列中的引脚基本上垂直于散热板的平坦的相对表面，以及与散热板和处理器的主表面接触的散热材料。 散热材料不与散热板的第二部分接触，并且销被构造成容纳在电路板上的插座组件中。
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公开(公告)号：US07345883B2
公开(公告)日：2008-03-18
申请号：US11684770
申请日：2007-03-12
IPC分类号： H05K7/20
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.
摘要翻译： 公开了一种处理装置。 它包括具有导热材料的散热板结构和具有主表面的处理器。 处理器在通电时产生热量，并且散热板结构适于散发来自处理器的热量。 散热材料与处理器和散热板结构接触。 引脚阵列中的引脚基本上彼此平行并且基本上垂直于处理器的主表面。 销可以被接收在电路板上的插座组件中。
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公开(公告)号：US07035108B2
公开(公告)日：2006-04-25
申请号：US10962364
申请日：2004-10-08
IPC分类号： H05K7/20
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： An information processing device is disclosed. The information processing device includes a heal dissipation plate structure including a thermally conductive material, and a processor including a major surface. A heat dissipating material is between and couples the processor and the heat dissipation plate structure. An array of pins is substantially perpendicular to the major surface of the processor. The device also includes a substrate including a plurality of holes, where the pins in the array of pins are configured to be inserted into the holes in the substrate.
摘要翻译： 公开了一种信息处理装置。 信息处理装置包括包括导热材料的愈伤耗散板结构和包括主表面的处理器。 散热材料在处理器和散热板结构之间并耦合。 销的阵列基本上垂直于处理器的主表面。 该装置还包括包括多个孔的基板，其中销列阵列中的销被配置为插入到基板中的孔中。
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公开(公告)号：US06608753B2
公开(公告)日：2003-08-19
申请号：US10315781
申请日：2002-12-10
IPC分类号： H05K720
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.
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公开(公告)号：US20070177357A1
公开(公告)日：2007-08-02
申请号：US11684770
申请日：2007-03-12
IPC分类号： H05K7/20
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.
摘要翻译： 公开了一种处理装置。 它包括具有导热材料的散热板结构和具有主表面的处理器。 处理器在通电时产生热量，并且散热板结构适于散发来自处理器的热量。 散热材料与处理器和散热板结构接触。 引脚阵列中的引脚基本上彼此平行并且基本上垂直于处理器的主表面。 销可以被接收在电路板上的插座组件中。
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公开(公告)号：US20050047096A1
公开(公告)日：2005-03-03
申请号：US10962364
申请日：2004-10-08
IPC分类号： G06K19/077 , H05K7/20
CPC分类号： G06K19/07735 , B41J29/377 , G06K19/077 , G06K19/07741 , G06K19/07743 , H05K5/0208 , H05K5/0256 , H05K7/20445
摘要： An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.
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