Invention Grant
US07361412B2 Nanostructured soldered or brazed joints made with reactive multilayer foils
有权
用反应性多层箔制成的纳米结构焊接或钎焊接头
- Patent Title: Nanostructured soldered or brazed joints made with reactive multilayer foils
- Patent Title (中): 用反应性多层箔制成的纳米结构焊接或钎焊接头
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Application No.: US10844816Application Date: 2004-05-13
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Publication No.: US07361412B2Publication Date: 2008-04-22
- Inventor: Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy P. Weihs
- Applicant: Jiaping Wang , Etienne Besnoin , Omar Knio , Timothy P. Weihs
- Applicant Address: US MD Baltimore
- Assignee: Johns Hopkins University
- Current Assignee: Johns Hopkins University
- Current Assignee Address: US MD Baltimore
- Agency: Lowenstein Sandler PC
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K31/02 ; B32B5/00 ; B32B15/01

Abstract:
Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.
Public/Granted literature
- US20050051607A1 Nanostructured soldered or brazed joints made with reactive multilayer foils Public/Granted day:2005-03-10
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