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    Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication
    2.
    发明授权
    Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication 失效
    用于在半导体制造中隔离，粘附和钝化铜金属的低电阻阻挡层

    公开(公告)号：US06380627B1

    公开(公告)日：2002-04-30

    申请号：US09105585

    申请日：1998-06-26

    Applicant: Timothy P. Weihs ,  Troy W. Barbee, Jr.

    Inventor： Timothy P. Weihs ,  Troy W. Barbee, Jr.

    IPC: H01L2348

    CPC classification number: H01L21/28568 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Cubic or metastable cubic refractory metal carbides act as barrier layers to isolate, adhere, and passivate copper in semiconductor fabrication. One or more barrier layers of the metal carbide are deposited in conjunction with copper metallizations to form a multilayer characterized by a cubic crystal structure with a strong (100) texture. Suitable barrier layer materials include refractory transition metal carbides such as vanadium carbide (VC), niobium carbide (NbC), tantalum carbide (TaC), chromium carbide (Cr3C2), tungsten carbide (WC), and molybdenum carbide (MoC).

    Abstract translation: 立方或亚稳态立方难熔金属碳化物作为阻挡层，以在半导体制造中分离，粘附和钝化铜。 金属碳化物的一个或多个阻挡层与铜金属化结合沉积以形成特征在于具有强（100）结构的立方晶体结构的多层。 合适的阻挡层材料包括耐火过渡金属碳化物，如碳化钒（VC），碳化铌（NbC），碳化钽（TaC），碳化铬（Cr3C2），碳化钨（WC）和碳化钼（MoC）。

    Methods of making reactive composite materials and resulting products
    4.
    发明申请
    Methods of making reactive composite materials and resulting products 审中-公开
    制备反应性复合材料和所得产品的方法

    公开(公告)号：US20110027547A1

    公开(公告)日：2011-02-03

    申请号：US11471779

    申请日：2006-06-21

    Applicant: Yuwei Xun ,  David Lunking ,  Etienne Besnoin ,  David Van Heerden ,  Timothy P. Weihs ,  Omar Knio

    Inventor： Yuwei Xun ,  David Lunking ,  Etienne Besnoin ,  David Van Heerden ,  Timothy P. Weihs ,  Omar Knio

    IPC: B32B3/10 ,  C21D8/00 ,  C06B45/12 ,  C06B45/16 ,  B21D31/00 ,  B21H1/22

    CPC classification number: B32B15/01 ,  Y10T428/24851

    Abstract: Applicants have discovered new composite materials and have developed a variety of new ways of making reactive composite materials (RCMs) and methods of controlling the properties and characteristics of the materials that are pertinent to numerous new or improved applications. This patent application is directed to new and improved ways of making reactive composite materials using mechanical deformation and making such materials with controlled, predictable characteristics. This application is also directed toward useful applications of the resulting materials.In accordance with the invention, RCMs are fabricated by a series of mechanical deformation steps. In the first deformation step, an assembly of reactive layers and/or particles is plastically deformed to reduce its cross sectional area by one-half or more. This severe initial deformation substantially eliminates the tendency of deformed layers to delaminate and eliminates the necessity of using specially cleaned metal layers. Portions of the deformed sheets are stacked or bent into a new assembly, and the new assembly is then deformed. The steps of assembly and deformation are repeated a sufficient number of times that the resulting materials are only locally layered but have relatively uniform reaction velocity and heat generating characteristics predictable by stochastic models derived herein. The resulting product is a controllable, locally layered reactive composite material (LLRCM) that can be fabricated quickly and is useful in a wide variety of applications.

    Abstract translation: 申请人已经发现了新的复合材料，并开发了各种新的制备反应性复合材料（RCM）的方法和控制与许多新的或改进的应用相关的材料的性质和特性的方法。 该专利申请涉及使用机械变形制造反应性复合材料的新的和改进的方法，并使得具有可控，可预测的特性的这种材料。 该应用也针对所得材料的有用应用。 根据本发明，通过一系列机械变形步骤制造RCM。 在第一变形步骤中，反应层和/或颗粒的组件塑性变形以将其横截面积减小一半以上。 这种严重的初始变形基本消除了变形层分层的趋势，并且消除了使用特别清洁的金属层的必要性。 变形的片材的一部分被堆叠或弯曲成新的组件，并且新的组件然后变形。 组装和变形的步骤重复足够次数，使得所得到的材料仅局部分层，但具有相对均匀的反应速度和通过本文得到的随机模型可预测的发热特性。 所得到的产品是一种可控制的局部层状反应性复合材料（LLRCM），可以快速制造，并可用于各种应用。

    GASKETLESS LOW TEMPERATURE HERMETIC SEALING WITH SOLDER
    5.
    发明申请
    GASKETLESS LOW TEMPERATURE HERMETIC SEALING WITH SOLDER 审中-公开
    无锡低温低温密封与焊接

    公开(公告)号：US20110024416A1

    公开(公告)日：2011-02-03

    申请号：US12666000

    申请日：2008-06-26

    Applicant: Yuwei Xun ,  David Van Heerden ,  Maureen A. Curran ,  Timothy P. Weihs

    Inventor： Yuwei Xun ,  David Van Heerden ,  Maureen A. Curran ,  Timothy P. Weihs

    IPC: B65D55/00 ,  B23K31/02 ,  B23K35/14 ,  B32B15/04

    CPC classification number: B23K20/16 ,  B23K2103/10 ,  Y10T428/31678

    Abstract: In accordance with the invention, containers or interfaces having two surfaces 201a and 201b to be joined, and a region to be sealed, are fused by providing between the surfaces 201a and 201b a thin strip or wire of RCM 102 embedded within a fusible material 101, applying pressure 205 and igniting the RCM 102. The released energy from the ignited RCM 102 results in a melting of the fusible material 101 and subsequent bonding of the fusible material 101 upon cooling to the 101 surrounding surfaces 201a and 201b, achieving a hermetic seal there between without the use of a separate gasket component.

    Abstract translation: 根据本发明，具有要接合的两个表面201a和201b以及待密封区域的容器或界面通过在表面201a和201b之间提供嵌入可熔材料101内的RCM 102的薄条或金属线来熔合 施加压力205并点燃RCM 102.来自被点燃的RCM 102的释放的能量导致熔融材料101的熔化，并且随后在冷却到101周围表面201a和201b时粘合可熔材料101，实现气密密封 之间没有使用单独的垫片组件。

    Method for forming a barrier layer
    8.
    发明授权
    Method for forming a barrier layer 失效
    形成阻挡层的方法

    公开(公告)号：US06339020B1

    公开(公告)日：2002-01-15

    申请号：US09567513

    申请日：2000-05-09

    Applicant: Timothy P. Weihs ,  Troy W. Barbee, Jr.

    Inventor： Timothy P. Weihs ,  Troy W. Barbee, Jr.

    IPC: H01L214763

    CPC classification number: H01L21/28568 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Cubic or metastable cubic refractory metal carbides act as barrier layers to isolate, adhere, and passivate copper in semiconductor fabrication. One or more barrier layers of the metal carbide are deposited in conjunction with copper metallizations to form a multilayer characterized by a cubic crystal structure with a strong (100) texture. Suitable barrier layer materials include refractory transition metal carbides such as vanadium carbide (VC), niobium carbide (NbC), tantalum carbide (TaC), chromium carbide (Cr3C2), tungsten carbide (WC), and molybdenum carbide (MoC).

    Abstract translation: 立方或亚稳态立方难熔金属碳化物作为阻挡层，以在半导体制造中分离，粘附和钝化铜。 金属碳化物的一个或多个阻挡层与铜金属化结合沉积以形成特征在于具有强（100）结构的立方晶体结构的多层。 合适的阻挡层材料包括耐火过渡金属碳化物，如碳化钒（VC），碳化铌（NbC），碳化钽（TaC），碳化铬（Cr3C2），碳化钨（WC）和碳化钼（MoC）。

    Mechanical processing of reactive laminates
    10.
    发明授权
    Mechanical processing of reactive laminates 有权
    反应层压板的机械加工

    公开(公告)号：US09186755B2

    公开(公告)日：2015-11-17

    申请号：US13503635

    申请日：2010-10-25

    Applicant: Timothy P. Weihs ,  Adam Stover

    Inventor： Timothy P. Weihs ,  Adam Stover

    IPC: B22F1/00 ,  B22F3/17 ,  B22F3/23 ,  B23K35/34 ,  B22F9/04 ,  B32B15/01

    CPC classification number: B22F1/0003 ,  B22F1/0011 ,  B22F3/17 ,  B22F3/23 ,  B22F9/04 ,  B22F2009/043 ,  B22F2009/047 ,  B22F2998/10 ,  B23K35/26 ,  B23K35/30 ,  B23K35/34 ,  B32B15/017 ,  Y10T428/2982 ,  Y10T428/2991 ,  B22F3/04 ,  B22F3/15 ,  B22F3/08

    Abstract: A method of producing a reactive powder includes providing a bulk structure of reactive material comprising a first reactant and a second reactant, the bulk structure having a preselected average spacing between the first and the second reactants; and mechanically processing the bulk structure of reactive material to produce a plurality of particles from the bulk structure such that each of the plurality of particles comprises the first and second reactants having an average spacing that is substantially equal to the preselected average spacing of the bulk structure of reactive material. The first and second materials of the plurality of particles react with each other in an exothermic reaction upon being exposed to a threshold energy to initiate the exothermic reaction and remain substantially stable without reacting with each other prior to being exposed to the threshold energy.

    Abstract translation: 制备反应性粉末的方法包括提供包含第一反应物和第二反应物的反应性材料的本体结构，所述本体结构在第一和第二反应物之间具有预选的平均间距; 以及机械处理反应性材料的本体结构以从本体结构产生多个颗粒，使得所述多个颗粒中的每个颗粒包含第一和第二反应物，其平均间隔基本上等于本体结构的预选平均间距 的反应性材料。 多个颗粒中的第一和第二材料在暴露于阈值能量以引发放热反应并且在暴露于阈值能量之前保持基本上稳定而不彼此反应的同时在放热反应中彼此反应。

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