发明授权
US07361581B2 High surface area aluminum bond pad for through-wafer connections to an electronic package
有权
高表面积铝合金焊盘，用于通过晶片连接到电子封装
- 专利标题： High surface area aluminum bond pad for through-wafer connections to an electronic package
- 专利标题（中）： 高表面积铝合金焊盘，用于通过晶片连接到电子封装
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申请号： US10904677申请日： 2004-11-23
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公开(公告)号： US07361581B2公开(公告)日： 2008-04-22
- 发明人: James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- 申请人： James W. Adkisson , Jeffrey P. Gambino , Mark D. Jaffe , Richard J. Rassel , Edmund J. Sprogis
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Anthony J. Canale
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A bond pad for effecting through-wafer connections to an integrated circuit or electronic package and method of producing thereof. The bond pad includes a high surface area aluminum bond pad in order to resultingly obtain a highly reliable, low resistance connection between bond pad and electrical leads.