发明授权
US07368205B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
失效
聚酰胺树脂，正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
- 专利标题： Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
- 专利标题（中）： 聚酰胺树脂，正性感光性树脂组合物，图案形成树脂膜的制造方法，半导体装置，显示装置以及半导体装置及显示装置的制造方法
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申请号： US10912841申请日： 2004-08-06
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公开(公告)号： US07368205B2公开(公告)日： 2008-05-06
- 发明人: Toshio Banba , Takashi Hirano
- 申请人： Toshio Banba , Takashi Hirano
- 申请人地址： JP Tokyo
- 专利权人： Sumitomo Bakelite Co., Ltd.
- 当前专利权人： Sumitomo Bakelite Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Smith, Gambrell & Russell
- 优先权： JP2003-288221 20030806
- 主分类号： G03F7/023
- IPC分类号： G03F7/023 ; G03F7/30
摘要：
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1 is a hydroxyl group or —O—R3 wherein m is an integer of 0 to 2; R2 is a hydroxyl group, a carboxyl group, —O—R3 or —COO—R3 wherein n is an integer of 0 to 4; R3 is an organic group having 1 to 15 carbon atoms; wherein, each of R4 and R5 is a divalent organic group; each of R6 and R7 is a monovalent organic group; n is an integer of 0 to 20.
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