Invention Grant
- Patent Title: High density memory module using stacked printed circuit boards
- Patent Title (中): 使用堆叠印刷电路板的高密度存储模块
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Application No.: US11775125Application Date: 2007-07-09
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Publication No.: US07375970B2Publication Date: 2008-05-20
- Inventor: Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
- Applicant: Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
- Applicant Address: US CA Irvine
- Assignee: Netlist, Inc.
- Current Assignee: Netlist, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.
Public/Granted literature
- US20080007921A1 HIGH DENSITY MEMORY MODULE USING STACKED PRINTED CIRCUIT BOARDS Public/Granted day:2008-01-10
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