Invention Grant
US07375978B2 Method and apparatus for trace shielding and routing on a substrate
有权
在基板上进行迹线屏蔽和布线的方法和装置
- Patent Title: Method and apparatus for trace shielding and routing on a substrate
- Patent Title (中): 在基板上进行迹线屏蔽和布线的方法和装置
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Application No.: US10746595Application Date: 2003-12-23
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Publication No.: US07375978B2Publication Date: 2008-05-20
- Inventor: John Conner , Brian Taggart , Robert Nickerson
- Applicant: John Conner , Brian Taggart , Robert Nickerson
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Marger Johnson & McCollom, PC
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14
Abstract:
Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.
Public/Granted literature
- US20050133255A1 Method and apparatus for trace shielding and routing on a substrate Public/Granted day:2005-06-23
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