Invention Grant
- Patent Title: Printed circuit board with interconnection terminal, a printed circuit assembly and electronic apparatus
- Patent Title (中): 具有互连端子的印刷电路板，印刷电路组件和电子设备
-
Application No.: US10580261Application Date: 2005-09-29
-
Publication No.: US07381066B2Publication Date: 2008-06-03
- Inventor: Masahiro Higashiguchi , Kunihiro Tan , Kazuhiro Yoneda
- Applicant: Masahiro Higashiguchi , Kunihiro Tan , Kazuhiro Yoneda
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro LLP
- Priority: JP2004-283078 20040929
- International Application: PCT/JP2005/017917 WO 20050929
- International Announcement: WO2006/035853 WO 20060406
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A printed circuit board comprises a base substrate and an external interconnection terminal provided on the base substrate, wherein external interconnection terminal comprises a land formed on a front surface of the base substrate and a metal plate soldered upon the land via a solder layer, a through-hole being formed in the base substrate such that the through-hole penetrates through the land and through the base substrate, the through-hole being filled with a solder such that the solder in the through-hole extends in continuation to the solder layer connecting the metal plate to the land.
Public/Granted literature
- US20070111557A1 Printed circuit board, a printed circuit assembly and electronic apparatus Public/Granted day:2007-05-17
Information query
