Invention Grant
- Patent Title: Solid-state image pickup device and manufacturing method for the same
- Patent Title (中): 固态摄像装置及其制造方法
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Application No.: US11324657Application Date: 2006-01-03
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Publication No.: US07382007B2Publication Date: 2008-06-03
- Inventor: Yoshiaki Kitano , Nobuhiro Karasawa , Jun Kuroiwa , Hideshi Abe , Mitsuru Sato , Hiroaki Ohki
- Applicant: Yoshiaki Kitano , Nobuhiro Karasawa , Jun Kuroiwa , Hideshi Abe , Mitsuru Sato , Hiroaki Ohki
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons LLC.
- Agent Robert J. Depke
- Priority: JP2003-098783 20030402; JP2003-390305 20031120
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L31/06 ; H01L29/04 ; H01L29/15

Abstract:
A solid-state image pickup device includes, in a substrate, a plurality of photoelectric conversion regions for subjecting incoming light to photoelectric conversion, a reading gate for reading a signal charge from the photoelectric conversion regions, and a transfer register (vertical register) for transferring the signal charge read by the reading gate. Therein, a groove is formed on the surface side of the substrate, and the transfer register and the reading gate are formed at the bottom part of the groove. With such a structure, in the solid-state image pickup device, reduction can be achieved for the smear characteristics, a reading voltage, noise, and others.
Public/Granted literature
- US20060108617A1 Solid-state image pickup device and manufacturing method for the same Public/Granted day:2006-05-25
Information query
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