发明授权
- 专利标题： IC card and method of manufacturing the same
- 专利标题（中）： IC卡及其制造方法
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申请号： US11423755申请日： 2006-06-13
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公开(公告)号： US07382045B2公开(公告)日： 2008-06-03
- 发明人: Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
- 申请人： Junichiro Osako , Hirotaka Nishizawa , Kenji Osawa , Akira Higuchi
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Miles & Stockbridge P.C.
- 优先权： JP2002-294721 20021008
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/12 ; H01L23/28
摘要：
An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
公开/授权文献
- US20060220202A1 IC CARD AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2006-10-05