Invention Grant
- Patent Title: Heat sink assembly
- Patent Title (中): 散热器组件
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Application No.: US11523902Application Date: 2006-09-19
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Publication No.: US07382617B2Publication Date: 2008-06-03
- Inventor: Chun-Huang Yu , Ren-Hung Huang
- Applicant: Chun-Huang Yu , Ren-Hung Huang
- Applicant Address: TW Taoyuan
- Assignee: Nanya Technology Corporation
- Current Assignee: Nanya Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Quintero Law Office
- Priority: TW95101600A 20060116
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.
Public/Granted literature
- US20070165382A1 Heat sink assembly Public/Granted day:2007-07-19
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