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15 条记录 (耗时 0.017 秒)

    Electronic device
    2.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US09072174B2

    公开(公告)日：2015-06-30

    申请号：US14049206

    申请日：2013-10-08

    申请人： Pei-Jen Lin ,  Wei-Chih Hsu ,  Sheng-Wei Wu ,  Chang-Hua Wei ,  Hui-Jou Tsai ,  Yao-Tsung Yeh ,  Kun-Hsin Liu ,  Wei-Hao Lan ,  Chun-Huang Yu ,  Pei-Yi Chu ,  Hong-Tien Wang ,  Shi-Kuan Chen

    发明人： Pei-Jen Lin ,  Wei-Chih Hsu ,  Sheng-Wei Wu ,  Chang-Hua Wei ,  Hui-Jou Tsai ,  Yao-Tsung Yeh ,  Kun-Hsin Liu ,  Wei-Hao Lan ,  Chun-Huang Yu ,  Pei-Yi Chu ,  Hong-Tien Wang ,  Shi-Kuan Chen

    IPC分类号： G06F1/16 ,  H05K7/02

    CPC分类号： H05K7/02 ,  G06F1/1632 ,  G06F1/1669 ,  G06F1/1684

    摘要： An electronic device includes a first body and a second body. The first body includes a first main body and a first magnetic element fixed in the first main body. The second body includes a second main body, a supporting unit, a second magnetic element, and a third magnetic element. The second main body is adapted to hold the first body. The supporting unit is pivoted to the second main body. The second magnetic element is fixed in the second main body. The third magnetic element is slidably configured in the second main body to restrict a rotation of the supporting unit relative to the second main body. When the first body leans against the second main body, the third magnetic element is subject to a magnetic attraction force from the first magnetic element and escapes from the supporting unit, so that the supporting unit supports the first body.

    摘要翻译： 电子设备包括第一主体和第二主体。 第一主体包括固定在第一主体中的第一主体和第一磁性元件。 第二主体包括第二主体，支撑单元，第二磁性元件和第三磁性元件。 第二主体适于保持第一主体。 支撑单元枢转到第二主体。 第二磁性元件固定在第二主体中。 第三磁性元件可滑动地构造在第二主体中，以限制支撑单元相对于第二主体的旋转。 当第一主体靠在第二主体上时，第三磁性元件受到来自第一磁性元件的磁力吸引力并从支撑单元逸出，从而支撑单元支撑第一主体。

    Heat sink assembly
    4.
    发明授权
    Heat sink assembly 有权
    散热器组件

    公开(公告)号：US07382617B2

    公开(公告)日：2008-06-03

    申请号：US11523902

    申请日：2006-09-19

    申请人： Chun-Huang Yu ,  Ren-Hung Huang

    发明人： Chun-Huang Yu ,  Ren-Hung Huang

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.

    摘要翻译： 用于从完全缓冲的双列直插式存储器模块中散热的散热器组件包括第一散热板，第二散热板和至少一个夹子。 第一个散热片覆盖全缓冲双列直插式存储模块。 夹子夹住第一散热片和第二散热片，其间夹有完全缓冲的双列直插式存储器模块。

    PORTABLE ELECTRONIC DEVICE AND CRADLE
    5.
    发明申请
    PORTABLE ELECTRONIC DEVICE AND CRADLE 有权
    便携式电子设备和包装

    公开(公告)号：US20130301201A1

    公开(公告)日：2013-11-14

    申请号：US13832033

    申请日：2013-03-15

    申请人： Wei-Chih Hsu ,  Shi-Kuan Chen ,  Hong-Tien Wang ,  Yung-Hsiang Chen ,  Shih-Chin Gong ,  Yung-Ming Tien ,  Chun-Huang Yu ,  Chao-Tung Hsu ,  Jui-Che Hsu ,  Chih-Yin Lai ,  Chia-Sheng Liu

    发明人： Wei-Chih Hsu ,  Shi-Kuan Chen ,  Hong-Tien Wang ,  Yung-Hsiang Chen ,  Shih-Chin Gong ,  Yung-Ming Tien ,  Chun-Huang Yu ,  Chao-Tung Hsu ,  Jui-Che Hsu ,  Chih-Yin Lai ,  Chia-Sheng Liu

    IPC分类号： H05K5/02 ,  F16M11/00

    CPC分类号： H05K5/0221 ,  F16M11/00 ,  G06F1/1632

    摘要： A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.

    摘要翻译： 提供了一种适于可拆卸地连接到具有容纳腔的托架的便携式电子设备，其中容纳腔的内壁具有凹部。 便携式电子设备包括主体和设置在主体中并包括驱动单元和闩锁的锁定和释放机构。 驱动单元设置在身体中。 闩锁连接到驱动单元并且适于被驱动单元驱动以从身体突出或隐藏在身体中。 当便携式电子设备设置在容纳空腔中时，驱动单元驱动闩锁突出到主体外并与凹槽接合。 当便携式电子设备将从容纳腔体分离时，驱动单元驱动闩锁以从凹部脱离并在身体中向后移动。

    PATTERN PROCESSING METHOD OF A WORKPIECE'S SURFACE
    6.
    发明申请
    PATTERN PROCESSING METHOD OF A WORKPIECE'S SURFACE 审中-公开
    工作表面的图案处理方法

    公开(公告)号：US20110308961A1

    公开(公告)日：2011-12-22

    申请号：US12886528

    申请日：2010-09-20

    申请人： Pei-Yi Chu ,  Chang-Kai Liu ,  Chun-Huang Yu

    发明人： Pei-Yi Chu ,  Chang-Kai Liu ,  Chun-Huang Yu

    IPC分类号： C25D9/00

    CPC分类号： C25D11/02 ,  C25D11/04 ,  C25D11/12 ,  C25D11/18

    摘要： A pattern processing method of a workpiece surface includes at least the following steps. A first anodized process is performed to a workpiece, wherein a surface of the workpiece includes at least one flat portion and at least one curved portion. A patterned film including a releasable substrate and an acid-base resistant ink layer disposed thereon is provided, wherein a surface of the releasable substrate on which the acid-base resistant ink layer is disposed faces the workpiece. A force is applied to an edge of the patterned film to adhere the patterned film the workpiece smoothly, so as to transfer a pattern of the acid-base resistant ink layer to the workpiece. The releasable substrate is removed. The workpiece is etched and the acid-base resistant ink layer is removed; and a second anodized process is performed to form a dichromatic anode three-dimensional texture.

    摘要翻译： 工件表面的图案处理方法至少包括以下步骤。 对工件执行第一阳极氧化处理，其中工件的表面包括至少一个平坦部分和至少一个弯曲部分。 提供了包括可释放基材和设置在其上的耐酸碱性油墨层的图案化膜，其中设置有耐酸碱性油墨层的可剥离基材的表面面向工件。 对图案化膜的边缘施加力以使图案化膜平滑地附着在工件上，以将耐酸碱性油墨层的图案转印到工件上。 去除可释放的基底。 蚀刻工件，除去耐酸碱性油墨层; 并且进行第二阳极氧化处理以形成二色阳极三维纹理。

    Heat sink assembly
    7.
    发明申请
    Heat sink assembly 有权
    散热器组件

    公开(公告)号：US20070165382A1

    公开(公告)日：2007-07-19

    申请号：US11523902

    申请日：2006-09-19

    申请人： Chun-Huang Yu ,  Ren-Hung Huang

    发明人： Chun-Huang Yu ,  Ren-Hung Huang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink assembly for dissipating heat from a fully buffered dual inline memory module includes a first heat-dissipating sheet, a second heat-dissipating sheet and at least one clip. The first heat-dissipating sheet covers the fully buffered dual inline memory module. The clip holds the first heat-dissipating sheet and the second heat-dissipating sheet between which the fully buffered dual inline memory module is sandwiched.

    摘要翻译： 用于从完全缓冲的双列直插式存储器模块中散热的散热器组件包括第一散热板，第二散热板和至少一个夹子。 第一个散热片覆盖全缓冲双列直插式存储模块。 夹子夹住第一散热片和第二散热片，其间夹有完全缓冲的双列直插式存储器模块。

    Electronic device
    8.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US09285838B2

    公开(公告)日：2016-03-15

    申请号：US14101357

    申请日：2013-12-10

    申请人： Yao-Tsung Yeh ,  Kun-Hsin Liu ,  Wei-Hao Lan ,  Yen-Hsiao Yeh ,  Hong-Tien Wang ,  Shi-Kuan Chen ,  Chun-Huang Yu ,  Shih-Chin Chou

    发明人： Yao-Tsung Yeh ,  Kun-Hsin Liu ,  Wei-Hao Lan ,  Yen-Hsiao Yeh ,  Hong-Tien Wang ,  Shi-Kuan Chen ,  Chun-Huang Yu ,  Shih-Chin Chou

    IPC分类号： G06F1/16

    CPC分类号： G06F1/1666 ,  G06F1/1616

    摘要： An electronic device including a first body, a second body, a linking member, a plurality of keys, and an actuating module is provided. The first body has a display surface and the second body is adapted to be connected to the first body. The linking member is disposed within the second body. The keys are movably connected to the second body. The actuating module is disposed within the second body and located between the linking member and the keys. The linking member moves via a relative movement between the first body and the second body, so that the actuating module pushes the keys to move from the inside of the second body to the outside of the second body.

    摘要翻译： 提供了包括第一主体，第二主体，连接部件，多个按键以及致动模块的电子装置。 第一主体具有显示表面，并且第二主体适于连接到第一主体。 连接构件设置在第二主体内。 键可移动地连接到第二主体。 致动模块设置在第二主体内并且位于连接构件和键之间。 连接构件通过第一主体和第二主体之间的相对移动移动，使得致动模块推动键从第二主体的内部移动到第二主体的外部。

    Memory module and electrical connector for the same
    9.
    发明授权
    Memory module and electrical connector for the same 有权
    内存模块和电连接器相同

    公开(公告)号：US08982566B2

    公开(公告)日：2015-03-17

    申请号：US13473060

    申请日：2012-05-16

    申请人： Hsin Mao Huang ,  Chun Huang Yu ,  Chih Yen Ho

    发明人： Hsin Mao Huang ,  Chun Huang Yu ,  Chih Yen Ho

    IPC分类号： H05K7/00

    CPC分类号： H01R12/721 ,  G06F1/185 ,  G11C5/04

    摘要： A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.

    摘要翻译： 存储器模块对包括第一和第二存储器模块。 第一和第二存储器模块中的每一个包括具有相对的第一和第二侧边缘和前边缘的电路板，多个引脚沿着该前边缘布置。 第一和第二存储器模块的每个电路板具有比第二侧边缘更靠近第一侧边缘形成的键槽。 第一存储器模块的电路板具有形成在前边缘和第一侧边缘上的拐角凹口，而第二存储器模块的电路板具有形成在前边缘和第二侧边缘上的角凹口 。

    CIRCUIT BOARD HAVING TIE BAR BURIED THEREIN AND METHOD OF FABRICATING THE SAME
    10.
    发明申请
    CIRCUIT BOARD HAVING TIE BAR BURIED THEREIN AND METHOD OF FABRICATING THE SAME 有权
    电路板及其制造方法

    公开(公告)号：US20140131085A1

    公开(公告)日：2014-05-15

    申请号：US13674919

    申请日：2012-11-12

    申请人： Hsin-Mao Huang ,  Chun-Huang Yu

    发明人： Hsin-Mao Huang ,  Chun-Huang Yu

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/242 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/113 ,  H05K1/117 ,  H05K3/244 ,  H05K2201/0338 ,  H05K2203/0228

    摘要： Provided is a circuit board having a tie bar buried therein. The circuit board includes a dielectric stack, at least a first tie bar, at least a first gold finger and at least a first microvia. The dielectric stack includes a first dielectric layer and a second dielectric layer. The first dielectric layer is located on the second dielectric layer. The dielectric stack includes a wireline region and a gold finger region. The first tie bar is buried in the gold finger region between the first dielectric layer and the second dielectric layer. The at least a first gold finger is located in the gold finger region on the first dielectric layer. The first microvia is located in the gold finger region in the first dielectric layer, and electrically connects the first gold finger to the first tie bar.

    摘要翻译： 提供一种具有埋入其中的连接杆的电路板。 电路板包括电介质叠层，至少第一连接条，至少第一金指和至少第一微孔。 电介质堆叠包括第一电介质层和第二电介质层。 第一电介质层位于第二电介质层上。 电介质堆叠包括有线区域和金指区域。 第一连杆被埋在第一介电层和第二介电层之间的金指区域中。 至少第一金手指位于第一介电层上的金指区域中。 第一微孔位于第一电介质层中的金指区域中，并且将第一金手指电连接到第一连接杆。