Invention Grant
- Patent Title: Resist collapse prevention using immersed hardening
- Patent Title (中): 使用浸入式硬化防止塌陷
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Application No.: US11043598Application Date: 2005-01-25
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Publication No.: US07384726B2Publication Date: 2008-06-10
- Inventor: Burn-Jeng Lin , Ching-Yu Chang
- Applicant: Burn-Jeng Lin , Ching-Yu Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: G03F7/00
- IPC: G03F7/00

Abstract:
A method, tool, and machine for hardening a photoresist image while the photoresist image is immersed in a liquid.
Public/Granted literature
- US20060166143A1 Resist collapse prevention using immersed hardening Public/Granted day:2006-07-27
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